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ZF-TRW S-Cam 3

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr

Continental MFC430TA

Generic Sample for:SP17324 - Bosch - MPC2SP17323 - TRW S-Cam 3SP17329 - Continental - MFC400

Bosch – MPC2

This generic sample displays elements from three reports. Each report contains the complete and detailed analysis of one system only.A complementary comparison report will be sent everyone who buys reports on these three cameras in a bundle.

Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Continental

Physical Analysis 8

o Views and Dimensions of the System

o System Opening

o Camera Module

o Image Sensor Board

Top Side – Global view

Top Side – High definition photo

Top Side – Main components identification

Bottom Side – High definition photo

o Electronic Board

Top Side – Global view

Top Side – High definition photo

Top Side – Main components markings

Top Side – Main components identification

Top Side – Other components markings

Top Side – Other components identification

Bottom Side – High definition photo

Bottom Side – Components identification

o CMOS Image Sensor

Package View and Dimensions

Package Disassembly

CIS – Die View

CIS – Cross-Section

Cost Analysis 46

o Accessing the BOM

o PCB Cost

o CIS Process Characteristics

o Cost Estimation of the ON Semiconductor CIS

o BOM Cost – Electronic Board

o BOM Cost – Image Sensor Board

o Housing Parts – Estimation

o BOM Cost - Housing

o Material Cost Breakdown by Sub-Assembly

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Details of Electronic Board AV Cost

o Details of Image Sensor Board AV Cost

o Details of the System Assembly AV Cost

o Manufacturing Cost Breakdown

Estimated Price Analysis 77

o Estimation of the Manufacturing Price

Company services 80

Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile

Physical Analysis

Cost Analysis

Manufacturing Price

About System Plus

The reverse costing analysis is conducted in several phases:

Reverse Costing Methodology

• The initialization of the analysis

Pictures of the elements to be studied.

Identification of the components.

• Description of the material in the “SYScost+” software

Creation of an “estimation project” of the studied board with SYScost+ software.

Construction of the Bill of Material (BOM).

• Assessing the material

Searching for the price of each reference among distributors and manufacturers.

Assessing the cost of the PCB and of the unaccounted references (unknown by distributors)

The BOM is valued with SYScost+ : price simulation according to the requested quantities.

• Assessing the assembling and test phases

Assembly and test lines are modeled with the SYScost+ software.

The assembly and tests costs are estimated.

• Production cost & selling price

Estimation of the production cost & selling price.

• Report

A report is edited.

SYS.cost+©, is a software tool developed by SYSTEM PLUS CONSULTING to calculate the cost of electronic boards. More information on the software can be found at www.systemplus.fr.

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

Views and Dimensions

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

System Opening

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

Camera Module

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

CIS Die View

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

CIS Cross-Section - Overview

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

Electronic Board – Top Side – Main Components Markings

Overview / Introduction

Company Profile

Physical Analysis o Views & Dimensionso System Openingo Image Sensor Boardo Electronic Boardo CMOS Image Sensor

Cost Analysis

Manufacturing Price

About System Plus

Electronic Board – Top Side – Main Components Identification

C O S TANALYSIS

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost

Manufacturing Price

About System Plus

PCB Cost – Electronic Board

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost

Manufacturing Price

About System Plus

BOM Cost – Electronic Board

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost

Manufacturing Price

About System Plus

Material Cost Breakdown by Component Categories

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost

Manufacturing Price

About System Plus

Assessing the Added-Value (AV) Cost

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Cost Estimationo BOM Cost – Electronicso Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdowno Added-Value Costo Manufacturing Cost

Manufacturing Price

About System Plus

Manufacturing Cost Breakdown – 1M units

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysis

Manufacturing Priceo Financial Ratioso Manufacturing Price

About System Plus

Estimation of the Manufacturing Price

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysis

Manufacturing Price

About System Pluso Company serviceso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT

• Imaging Technologies for Automotive 2016• Sensors and Data Management for Autonomous Vehicles report

2015• Camera Module Industry Report

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

• LeddarVu8: The first off-the-shelf solid state high-definition LiDAR module from LeddarTech

• Camera Module Industry 2015 – Mobile CCM Technology Review

COMPANYSERVICES

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysis

Manufacturing Price

About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings

Overview / Introduction

Company Profile

Physical Analysis

Cost Analysis

Manufacturing Price

About System Pluso Company serviceso Feedbackso Contacto Legal

Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 16sales@systemplus.fr

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 82llevenez@systemplus.fr

America Sales OfficeSteve LAFERRIEREPhoenixUSAlaferriere@yole.fr

www.systemplus.fr

Asia Sales OfficeTakashi ONOZAWATokyoJAPANonozawa@yole.fr

Mavis WANGGREATER CHINAwang@yole.fr

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

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