har tsv presentation

Technology Review of High Aspect Ratio Through-Silicon-Via

Eric Johnson, Chulyong Kim, Bon Woong Ku,Amechi Toya, Shuchen Zhang

Georgia Institute of Technology

Agenda

1. Introduction and Background2. Process Flow3. Electrical Properties4. Mechanical Properties5. Design Impact6. Future Technologies

Cross section of a TSVSource: [3]

TSV Background

Sources: [1,2]

TSV Background

Sources: [1,2]

Source: www.samsung.com

Benefits Of TSV

Source: [2]

Why High Aspect Ratio?

TSV Scaling and Function Density

Source: [2]

2009 2015

TSV Size (um) 1.5 1.0 0.55

Device Area (um2) 0.82 0.20

TSV-to-Device 2.74 5.00 2.74

TSV Scaling

Aspect Ratio = 10 Aspect Ratio = 10 Aspect Ratio = 16.7

Source: [3]

TSV fabrication

(a) SiO2 deposition(b) Photoresist patterning(c) SiO2 patterning(d) Etching(e) SiO2 deposition(f) Backside thinning(g) Backside SiO2 deposition(h-j) Electroplating(k) CMP

Source: [Modified from 4]

Etching

•••

–••

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Etching

•––

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•

•

Source: [10]

Isolator Deposition

•–

• •

–

•

–

•

•

Source: [11]

•

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Isolator Deposition

Source: [12]

Barrier / seed layer deposition➔ Barrier Deposition

● Electroless barrier deposition- Ni-B, Ni-W-B, Co-B, Co-W-B (Ni- and Co-alloys)○ Better Step coverage, good uniformity.○ High adhesion strength. (~56MPa)○ Holds up against Cu diffusion up to ~300-400℃● Chemical Grafting- NiB○ Conducting, eliminates the need for a seed

layer.○ Forms strong bond with isolation polymer

(P4VP).○ Uniformity, good step coverage.

➔ Seed Deposition● Electroless Cu seed deposition.- Good step coverage (prevents voids)

Source [14]

Cu Filling● Electroplating- Needs conducting seed layer with

good step coverage.- Additives have to be introduced to

ensure the copper ions get to the bottom of the via for better filling.

-● Electroless plating- Conductivity of surface is irrelevant.- No void.- Bottom-up filling is possible with

additives that have high diffusion coefficient.

Source [9]

Source [13]

COST BREAKDOWN OF 3D IC FABRICATION

Source: [8]

General Electrical Properties● Short interconnect length compared to wirebonding

○ Lower interconnect delay○ Higher Bandwidth

● Marginal electrical changes with higher aspect ratio

Wirebond Traditional TSV HAR TSV

Interconnect Length Long Short Short

I/O Density Low Med High

Back of Line Delay High Low Low

HAR TSV Electrical Properties

Source: [6]

Mechanical Reliability of TSV•

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Thermomechanical Properties of the Materials

Mechanical Reliability of TSV•

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Mechanical Reliability of TSV•

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••

••

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Limitation of normal TSV usageHuge silicon area / parasitic overhead

Normal TSV HAR TSV

Source: [5]

Design Impact of HAR TSV usagePhysical design result shows that HAR TSV maximizes 3D IC

37% area saving, 12% performance saving, little power consumption overhead

Source: [5]

Future of 3D interconnect technologyMonolithic 3D: To fabricate the top tier monolithically

minimizing vertical interconnection overhead

Source: [7]

TSV 3D vs. Monolithic 3DHigh Alignment Precision leads to small 3D via

Source: [15,16]

Monolithic Inter-tier Via

TSV

ConclusionTSV scaling and HAR TSV technology is required

because device scaling continues, but also for the miniaturization of the system

We discussedHAR TSV-specific fabrication issues and potential solutions, and its characteristics

We reviewedHAR TSV leads to minimum 3D interconnection overhead, and maximum 3D benefit

Future technology of 3D interconnectMoves from HAR TSV toward Monolithic 3D that provides with nm-scale 3D via

References[1] Rao R. Tummala, Introduction to SIP Stacked ICs and Packages (SIP), Lecture, Georgia Tech, 10/6/2016.[2] Rao R. Tummala et al, Introduction to System-On-Package, 2004.[3] Sesh Ramaswami, Through Silicon Via (TSV) Interconnect, Lecture, Georgia Tech, 10/4/2016.[4] A. Yu et al., “Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 9, pp. 1336–1344, 2011. [5] D. H. Kim and S. K. Lim, “Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices,” IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 2, no. 2, pp. 240–248, 2012.[6] H. He, J. J. Q. Lu, Z. Xu and X. Gu, "TSV density impact on 3D power delivery with high aspect ratio TSVs," ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference, Saratoga Springs, NY, 2013, pp. 70-74.[7] Shreepad Panth, Kambiz Samadi, Yang Du, and Sung Kyu Lim, "Design and CAD Methodologies for Low Power Gate-level Monolithic 3D ICs," IEEE International Symposium on Low Power Electronics and Design, 2014.[8] Claudio Truzzi, A Novel Approach to TSV Metallizaiton based on Ectrografted Copper Nucleation Layers,” Lecture, Alchimer, 9/25/2008.[9] Myong-Hoon Rho, et al., “Various Cu Filling Methods of TSV for Three Dimensional Packaging,” Journal of KWJS Vol. 31 No. 3. Pp11-16. 2013.[10] Arturo A. Ayon, PEUG talk, may 2001.[11] Dow Corning Corporation, Midland, MI [12] T. Dequivre, E. Alam, J. Maurais, “Electrografted P4VP for high aspect ratio copper TSV insulation in Via-last process flow,” pp. 340-344, 2016.[13] Zengling Wang, et al., “Bottom-up fill of submicrometer copper via holes of ULSIs by electroless plating,” Journal of The Electrochemical Society, 151 (12) C781-C785 (2004).[14] Fumihiro Inoue, et al., “All-Wet Fabrication Technology for High Aspect Ratio TSV Using Electroless Barrier and Seed Layers,” Kansai University, 3-3-35 Yamate-cho, Suita, Osaka, Japan.[15] Brunet, Laurent, et al. "(Invited) Direct Bonding: A Key Enabler for 3D Monolithic Integration." ECS Transactions 64.5 (2014): 381-390.[16] C. Liu and S. K. Lim, "A design tradeoff study with monolithic 3D integration," Thirteenth International Symposium on Quality Electronic Design, Santa Clara, CA, 2012, pp. 529-536.

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