5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

completion of any service or repairs thisproduct,Ask the service thechnician to performsafety check to determinw that product is inproper operatin condition

Unauthorized substitution may result infire,electric shock or other hazardsupon

by the manufactruer or have the samecharacteristics,as the originalparts

DC:140mA-93mA

DC:140mA-93mA

technician has used replacement parts specified

AC:200mA-1.4mA

AC:200mA-1.4mA

to qualifled service presonal whenreplacement parts are required surethe service

0.8A-1.3A

Note:Damage rquring service,unplug this producefrom the wall oulet and refer servicing

15.7mA-19mA

specitied in the circuit for safety reasonscomponent shall be replaced only by thecomponent

Ajacent to relevant component demoting specific

EMC PART

Checked:

AC TO DC

SHEET:

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

Design:

1 OF VER: A

DWG NO.:DV5312-YL01-03

TITLE:

Apprd: 5

PART NO.:

MODEL: DV5312

11mA-19mA

USB/DIGI AUDIO/RGBCVBS/IR

P+5V

F-

MIC12V

F+

STB12V

+12V

STB12V

A+5V

-12V P-12VSTB-25V

STB12V

+5V

+5V5V

5V

STB-25V

STBYSTANDBY

P+5V

MIC12V

P+5V

F+

F-

P-12V

STBY

GND

GND

GND

C98

100UF/35V

C106

0.1UF

BC6

0.1UF

R20

1K

Q65401

1

23

FB7 FB

12

L28

FB0805

L1

FB0805

C104

0.1UF

R23

10K

R163

100K/0.5W

R11

1K/0805

R420

D16

RS1K_SMD

R79

4.7K

Q38550

1

2 3

Q5

5551

1

2 3

R150100

R149

4.7K

R10

10K

R3

100R/0805

Z1

12V/1W_SMD

C99

222/1KV

C1101

U12 PC8174

23

14

23

1

R710K

Q23904

1

23

F2T2AL/250V

12

C101

100UF/50V

L5

10UH/1A_SMD

12

IC1

TL431

23

1

R19

10K

C102

100UF/50V

D14

RS1K_SMD

R152

2K

L36 1206+EC3

10uF/400V

R22510R/0805

L8NC/FB0805

L34.7U/1A_0805

12

+

EC410uF/25V

R6

100K

L7 NC/FB0805

R21

10K

D12

RS1K_SMD

CON1

~AC100-240V INPUT VOLTAGE

12

12

CON2ON/OFF Button(SW)

12

T2

EEL19

1

4

2

3

5

11

12

10

9

8

7

6

C96

100UF/25V

Z2

7.5V/1W_SMD

+ EC110uF/400V

U10

TNY-275PN

1 2

5

3467

EN BP

S

DSSS

L35

10U/1A_SMD

12

R5

680R

BR1GB206

1 3 2 4

1 3 2 4

R18100K

C94

100UF/25V

BC11

0.1UF

Q48050/DIP

1

23

Q7

BT8550

1

23

R91K/0805

C109

0.1UF

D15

SR360

R153

1K

R8

4K7

L4 NC/FB0805

C95

100UF/25V

L21mH/0.05A/6X8

L30

10UH/2A

12

R154

0R/0.5W/1206

R13

10K

C87

1000UF/16V

R151

1K

L6 NC/FB0805

C39

470UF/16V

D13

RS1K_SMD

Y1

222/400V

C97

100UF/35V

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

FS1: H=RGB L=CVBS

FS2 FS3000110

4:3SCART CFG

TV16:9

SCART config circuit

Close to Q22

5 OF

JACK+VIDEO+SCART

Checked:

VER: A

MODEL: DV5312

SHEET:

DWG NO.:DV5312-YL01-03

Design: TITLE:

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

Apprd:

PART NO.:

5

CVBS

CVBS_G_Y

RGB/CVBS

COAX_SPDIF

YUV-YCr/YC-Y_OUT

RMAIN-OUT

RGB/CVBS

16:9/TV

COAX_SPDIF

CVBS_C

P+5V

S/PDIF_OUT

STB

CVBS

P+12V

16:9/TV

CVBS

YUV-Y

YUV-Y

Cr/YC-Y_OUT

Cb/YC-C_OUT

Cb/YC-C_OUT

C_B_U

LMAIN-OUT

D5VOPTICAL_SPDIF

-25VF+F-

P+5VDATACLK

IRRCV

Cr/YC-YY_R_V

Cr/YC-Y

Cb/YC-C

Cb/YC-C

Cb/YC-C_OUT LMAIN-OUT

Cr/YC-Y_OUT CVBS

C_B_U

FPC_DOUT

CVBS_C

FS1

FPC_CLKFPC_STBIRRCV

Y_R_V

CVBS_G_Y

Y_C_CVBS

FS3

FS2LMAIN-OUTRMAIN-OUT

LMAIN-OUT

RMAIN-OUT

SL-OUT

SR-OUT

CEN-OUT

LFE-OUT

S/PDIF_OUT

-25VF-F+

P+5V

P+12V

P+5V

D5V

P+5V

J1AUDIO 6CH

1

7

2

4

3

8

5

9

6

Q24BT3904

1

23

Q23BT3904

1

23

CON12

9PIN/2.0

123456789

R210

56R

TP10

R2392.2K

TP78

R247

0R

C148150pF

R2021K5

TP7

C193101

R217

2R/0805

TP17

TP77

TP20

R14

22R

R249

0R

TP8

TP67

C143150pF

TP76

C174150pF

TP9

TP82

TP48

C153

0.1uF

TP75

TP22

R192 75R TP3

R250

NC

C194101

TP49

TP80

Q1BT3904

1

23

Q22

BT39041

23

TP81

R201 75R

R248

NC

R234

4K7

R122

TP4

TP13

TP50

TP23

J3 AV4

1

2

3

6

4

5

TP14

TP47

C138150pF

C195101

CON3

9PIN/2.0

123456789

R21427R

R205 75R

C152

22pF

J2

SVIDEO&CVBS

12346

75

8 9

TP83

TP5

TP19

CON13

3PIN/2.0

123

C1210.1uF

TP72

TP6

TP73

R2071K2

R22910K

C132150pF

R23010K

R155

56R

R17675R

TP12

C158101

R164 33R

R20410K

TP79

TP11

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

AMUTE or MUTE_CTL:Hi: Mute.

4 OF

AUDIO+KARAOKE

Checked:

VER: A

MODEL: DV5312

SHEET:

DWG NO.:DV5312-YL01-03

Design: TITLE:

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

Apprd:

PART NO.:

5

MUTE

MUTE

RMAIN-OUT

MUTE

MUTE+12VA

MUTE

MUTE

-12VA

+12VA

+12VA

-12VA

-12VA

P-12V

LMAIN-OUT

MUTE_CTL

AMCLKAINABCLK ALRCLK

MUTE

P-12V

MIC1

MIC_VOCAL

DSPVCC33

ADCVCC33DSPVCC33 ADCVCC33

ADCVCC33

-12VA

+12VA

+12VA

-12VA

+12VA

+12VA

-12VA

-12VA

LRIN P+12V

MIC12V

MIC1

MIC2

MIC2

LRIN

APWM_R-

APWM_R+

LMAIN-OUT

RMAIN-OUT

APWM_L-

APWM_L+

APWM_CEN-

APWM_CEN+

APWM_LFE-

APWM_LFE+

CEN-OUT

LFE-OUT

APWM_SL+

SR-OUT

SL-OUT

APWM_SR+

APWM_SL-

APWM_SR-

MUTE_CTL

AMCLKALRCLKABCLK

AIN

MIC_VOCAL

MIC12V

P-12V

P+12V

P-12V

D5V+12V

DSPVCC33

CON10

5P/2.0

12345

D2NC/4148

12

R253 4.7K

FB6 FB

R30347K

Q27BT3904

1

23

R29110K

R2592K

C2241.5nF

R273NC/1K

+C20147uF/16V

R12NC/0R

C128 160pF

Q29BT8550

1

2 3

R295

2K2

R279 2K2

D23 LL41481 2

R231 1K

C222 160pF

+ C211

100U/16V

R186

2K2

R2622K7

TP1

C228

0.1uF

R271

NC/1K

D1

NC/4148

12

R25547K

C227

0.1uF

R28847K

R274

1K/NC

R299 43K

R269NC/10K

R286 43K

C1241nF

TP2

C212

104

R300 43K

+ C209

10U/16V

R254 47K

R282 2K2

R311 0R

R296 1K

R242 2.2K

R260 33R

D22LL4148

12 C223

1nF

R200 10K

+

-

U9ALM4558

3

21

84

TP71

R309

NC/0RU11

CE2632

1234567 8

91011121314DVDD

SDOUTBCLKFMTCAPVREFRIN LIN

AVDDAGNDNOHP

LRCLKMCLKDGND

R294 2.2K

C2781.5nF

R25247K

+

-

U8BLM4558

5

67

84

R257 47K

R284 43K

R29210K

R221 43K

C2211nF

R280 1k

Q25BT3904

1

23

C1311nF

R281 2.2K

R301 43K

TP70

C214 160pF

R25847K

R30810K

R25110K

R3100R

R43 3.3K

+

-

U7ALM4558

3

21

84

R199 1K

R256100K

C1921.5nF

R306 47K

R30710K

C198

0.1uF

R198

2K2

C220 160pF

C2251.5nF

C2151nF

R182 100K

R218 2.2K

R285 43K

R219 43K

C226

0.1uF

TP18

R305 47K

C123 160pF

R28747K

R159100K

+ C208

10u/16V

C19647uF/25V

R289 47K

Q34BT3904

1

23

+

-

U8ALM4558

3

21

84

R30447K

C184

0.1uF

R302 43K

+

-

U7BLM4558

5

67

84

+C20047uF/16V

R220 43K

R272

0R/NC

Q28BT3904

1

23

C1631.5nF

R243 43K

C2171nF

C231100uF/16V

C2191.5nF

R2931K

C206

104

Q32BT3904

1

23

R278

2.2K

Q33BT3904

1

23

Q31BT3904

1

23R283 43K

C229

0.1uF

C216 160pF

R277 1k

R297 2.2K

+C197

10uF/16V

R261 33R

R23210K

R298

2K2

Q20 BT8550

1

2 3

R290 47K

+

- U9BLM4558

5

67

84

R2632K7

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

LOAD+

GND

LOAD-

INSW

OUTSW

1.25V 1.25V

BEMF

HOMESWGND

SL-

SP-SP+

SL+

Current Type(Default)

Close to motor driver.

Checked:

Design:

Apprd:

R161=300R, for HOP1200W onlyinclude arima , R161=0R

PDIC Control:DVD=LOWCD=HIGH

OPU HD65PS OthersR175: 3.3R 4.7R R189: 3.3R 4.7R

2.1V

PDIC Control:DVD=LOWCD=HIGH

R202=300R, for HOP1200W only

2.1V

CN201 is used for Sanyo/Samsung/Sony OPUs

OPU HD65PS OthersR221: 3.3R 4.7R R224: 3.3R 4.7R

VR_CD

CD_DVD

3V3_DRV

3V3_FB

OPU5VVC1

TACT-

FACT+

CDLD

FACT-

OPU_HFM

VR_DVD

FOCUS_SSLED_STRACK_SSPDL_S

SP_M-

INSW

SP_MOT-

TACT+

1V8_FB

3V3_DRV

1V8_DRV

LOAD+

SLED_S

CLOSE

FACT+

TACT-

OPEN

3V3_FB

VC2

SL_MOT+

SL_MOT-

SP_M-

SPDL_S

SL_MOT+

FOCUS_S

TRACK_S

SP_MOT+

1V8_DRV

1V8_FB

HOMESWVR_CD

LOAD-

FACT-

SPDL_SENS-

SPDL_SENS+

SL_MOT-

SP_MOT+SP_MOT-

LOAD+LOAD-

TACT+

MD_DVD

VR_DVD

DVDLD

MD_CD

HOMESWIN_OUT_SW

RFRF_CRF_BRF_ARF_DRF_FRF_E

OPU_HFM

VR_DVD

OPU5V

DVDLD

VC1

VR_CD

CDLD

CD_DVD

VR_DVD

TACT+TACT-

CDLD

FACT+

DVDLD

OPU5V

OPU_HFM

FACT-

VR_CD

VC1

RF_BRF_C

RF_D

RF

RF_FRF_E

CD_DVD

MD_CD

MD_DVD

IN_OUT_SWHOMESW

FOCUS_SSLED_S

TRACK_SSPDL_S

CLOSE

OPEN

SPDL_SENS+

SPDL_SENS-

INSW

DRVSB

RF_A

LD_DVD

LD_CD

VC

RF_A

RF_FRF_B

RF_E

RF_CRF_D

CD_DVDRF

DSPVCC18DSPVCC33

P+5V

DSPVCC33

P+5V

P+5V

DSPVCC33

DSPVCC33

DSPVCC33

DSPVCC33

P+5V

RFA5V

(value) is for AM5888s

U5AM5888S

1

2

3

4

5

6

7

8

9

10

11

12

13

14

28

27

26

25

24

23

22

21

20

19

18

17

16

15

29 30

VINFC

CFCERR1(TRB_1)

CFCERR2(REGO2)

VINSL+

VINSL-(REGO1)

VOSL(FWD)

VNFFC(REV)

VCC

PVCC1(LOAD-)

PGND(LOAD+)

VOSL-(VOSL+)

VOSL+(VOSL-)

VOFC-

VOFC+

STBY

BIAS

VINTK

CTKERR1(TRB_2)

CTKERR2(NC)

VINLD

PREGND

PVCC2

VNFTK(NC)

PGND(VCC2)

VOLD-

VOLD+

VOTK-

VOTK+

GN

DG

ND

1

CON7

6P 2.0: SLED & SPINDLE Con

654321

R168

2K

D19

1N4002

1 2C1660.1uF

TP63

C136470P

TP87 R16533K

R15 33R

CON9

24P/0.5

2322212019181716151413121110987654321

24TR+FO-FO+

MD(DVD)VCC/NC

VR(DVD)GND(DVD)

LD(DVD)LD(CD)VR(CD)

GND(CD)MD(CD)NC/SEL

V-RFV-CV-BV-AV-DV-FV-EVccVs

GND

TR-

C1461nF

TP52

TP68

R244 100R

TP58

C1560.1uF

R235100R

Q378550

1

23

C1411nF

C1341nF

R17 0R

TP64

D21 4148

1 2

R22810K

Q268550

1

23

TP86

+C175220uF/16V

+ C179100uF/16V

TP69

R2401K 1%

TP53

R1601K 1%

C1470.1uF

R2260R

TP57

TP27

R187100R

R22512K 1%

TP84

TP56

CON1424Pin OPU connector

242322212019181716151413121110987654321

2526

GND-LDDVD-LD

NCHFM

MDCD-LD

VR-DVDVR-CD

NCE

VCCVC(VREF)

GND/PDFBA

RFCD/DVD_SW

DCT-T+F+F-

GN

D

GN

D

CON8

5p 2.0: TRAY_Con

54321

TP40

R1974.7K

R3173.3K

TP61

TP85

TP41

Q218550

1

23

R185NC

C1290.1uF

R1624.7K

+ C18847uF/16V

Q358550

1

23

R1894.7R

R1754.7R

TP39

TP55

TP42

TP54

+ C178100uF/16V

R2221R

TP44

R22420K 1%

TP60

R236NC

Q388550

1

23

R245 100R

Q368550

1

23

R2230R

TP46

D181N4002

12

D24 4148

1 2R161

0R

TP65 R1724.7K

TP88

R216 2R/0805

R2274K3 1%

R177

2K

+ C230220uF/16V

TP62

TP59

R167 220R

C130470P

R181 220R

TP51

TP66

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

Vaddis 9

Close to Pin37 of U15

R195 R194Flash selectIntel NC 0RAMD/SST 0R NC

A19

NCNCRY/BY#

BYTE#

Use it to connect the shell of the crystal with ground.

Close to Vaddis!

Close to Vaddis!

Close to Vaddis!

Important power supply!

MUX GPIOs

500mA for device

EEPROM

Crystal

Close to Vaddis

Close to pin 105

UART:For customer model, please just keep test point close to Vaddis.

Close to Vaddis

SDRAM configuration:1X16Mbit: CS0# = Low;1X64Mbit: CS1# = Low; CS0#=BA1SDRAM speed <=7nsTras <=44.4nsTrp <=22.2ns

Flash speed <= 70 nS.If plan to use 90ns Flash, it needs to be verified by s/w.

Note: While using different OPU,use the same parameter forAM5888S

While using AM5888SR211

R213R206

R209

51K51K

51K22K

JP1BOOTSELPlay OPENDownload CLOSE

2 OF

DSP+SDRAM+FLASH

Checked:

VER: A

MODEL: DV5312

SHEET:

DWG NO.:DV5312-YL01-03

Design: TITLE:

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

Apprd:

PART NO.:

5

ADD FOR STB REALLY

ADD FOR (D)

RA

MC

AS

-

RA

MD

AT5

RA

MD

AT4

RA

MA

DD

8

RA

MD

AT1

5

RA

MD

AT9

RA

MA

DD

7

RA

MD

QM

RA

MA

DD

4

RA

MW

E-

RA

MA

DD

9

RA

MA

DD

0

RA

MD

AT7

RA

MA

DD

10

RA

MA

DD

1R

AM

AD

D2

RA

MD

AT1

1

RA

MD

AT6

RA

MD

AT0

RA

MC

S0-

RA

MD

QM

RA

MA

DD

5R

AM

AD

D6

RA

MD

AT1

0

RA

MR

AS

-

RA

MB

A

RA

MD

AT1

RA

MD

AT1

3R

AM

DA

T2

RA

MD

AT1

2

RA

MA

DD

11

PC

LK

RA

MA

DD

3

RA

MC

S1-

RA

MD

AT8

RA

MD

AT1

4

RA

MD

AT3

RA

MB

A

RA

MD

QM

RA

MA

DD

6R

AM

AD

D5

PC

LK RA

MD

AT1

1

RA

MR

AS

-

RA

MD

AT0

RA

MC

S0-

RA

MA

DD

3

RA

MD

AT1

RA

MD

AT1

2R

AM

DA

T13

RA

MD

AT1

0

RA

MD

AT2

RA

MD

AT4

RA

MC

AS

-

RA

MD

AT1

4

RA

MA

DD

1

RA

MD

AT3

RA

MD

AT8

RA

MD

AT1

5

RA

MD

AT9

RA

MA

DD

7

RA

MA

DD

9

RA

MD

AT7

RA

MW

E-

RA

MA

DD

10

RA

MD

AT5

RA

MA

DD

4

RA

MA

DD

0

RA

MD

QM

RA

MA

DD

2

RA

MD

AT6

SDRAM3.3V

SDRAM3.3V

MEMADD16

MEMDAT15MEMDAT7MEMDAT14MEMDAT6MEMDAT13MEMDAT5MEMDAT12MEMDAT4

MEMDAT11MEMDAT3MEMDAT10MEMDAT2MEMDAT9MEMDAT1MEMDAT8MEMDAT0

MEMADD0

MEMWR#

MEMRD#

VDDPLL

VDD1AFE

OSCIN

OSCOUT

FOCUS_STRACK_S

SPDL_S

RF

DUPRD0DUPTD0

FS2FS1

AMCLK

I2C

_CLK

I2C

_DA

T

AP

WM

_LFE

+

DUPTD1

VDDPLL

RA

MD

AT8

RF_

F

RAMADD5 APWM_SL-

APWM_L-

IRRCV

DUPRD1

VDDDAC

RA

MD

AT3

RAMADD2

MIC

_VO

CA

L

RF_

B

APWM_CEN-

FPC_CLK

RA

MD

AT1

5

MEMDAT10

ME

MR

D#

CVBS_G_Y

CVBS_C

RA

MD

AT0

RA

MD

AT5

RA

MD

QM

MEMADD7

C_B_U

S/PDIF_OUT

RA

MD

AT1

1

IPC

LK

MEMDAT13

VD

D1A

FE

MEMCS0#

Y_C_CVBS

Y_R_V

OSCOUT

RA

MD

AT1

2

SP

DL_

SE

NS

-

RF_

C

VDDAFE

APWM_SR+

FPC_DOUT

RA

MD

AT1

MEMADD10

MD

_CD

SLE

D_P

WM

ME

MD

AT0

DRVSB

RA

MD

AT1

0

RA

MW

E-

MEMADD9

ME

MA

DD

0

MEMDAT15

MEMDAT5

USB_DPUSB_DN

RA

MA

DD

0

RF_

D

SP

DL_

SE

NS

+

SP

DL_

PW

M

RAMADD4

APWM_SR-

DUPTD0

OSCIN

RA

MD

AT6

RA

MR

AS

-

USB_DP

RE

SO

UT

MD

_DV

D

ME

MC

S0#

ME

MD

AT8

RA

MC

AS

-

USB_DN

ABCLK

AINHOMESWOPEN

RA

MD

AT4

RA

MA

DD

10

RAMADD1

VC

AP

WM

_LFE

-

MEMDAT3

VD

DA

FE

RF_

E

ME

MD

AT9

VDDDAC

APWM_SL+

APWM_L+

DUPRD0

RA

MD

AT1

4

RA

MD

AT1

3

RF_

A

LD_D

VD

ME

MD

AT1

APWM_CEN+

ALRCLK

IN_OUT_SW

FPC_STB

VDDDAC

MEMADD15

RFN

VD

DA

FE

VD

DP

WM

VDDPWM

APWM_R+

CLOSE

RA

MA

DD

8

MEMADD6

MEMDAT14

MEMDAT4MEMDAT11

RFP

LD_C

D

VR

EF

APWM_R-

I2C_CLKI2C_DAT

DUPTD1 FS3

INSW

DUPRD1

TRA

CK

_PW

M

VDDAPWM

RESET#

MEMADD17

MEMADD19MEMADD1MEMADD2

MEMADD3MEMADD4MEMADD5

MEMADD18MEMWR#MEMADD8

MEMADD11MEMADD12MEMADD13MEMADD14

MEMADD16

MEMDAT7

MEMDAT6

MEMDAT12

MEMDAT2

FCU

_SC

LK

FCU

_RS

T

FCU

_IO

RD

#

FCU

_WA

IT#

FCU

_CS

2#

FCU

_IO

WR

#

FCU

_CS

3#

MEMADD15MEMADD14MEMADD13MEMADD12MEMADD11MEMADD10MEMADD9MEMADD8

MEMADD18MEMADD17MEMADD7MEMADD6MEMADD5MEMADD4MEMADD3MEMADD2MEMADD1

MEMADD19

MEMADD1

PCLK

IPC

LK

RAMADD7

RAMADD6

RAMADD3R

AM

AD

D9

RA

MD

AT2

RA

MD

AT7

RA

MD

AT9

FOC

US

_PW

M

RESET#

MEMDAT13

FCU_WAIT#

FCU_SCLKDSPVCC33MEMDAT12

FCU_RSTFCU_CS2#FCU_CS3#

RA

MB

A

RA

MA

DD

11R

AM

CS

0-

RA

MC

S1-

MUTE_CTL

RESET#

SLED_S

FCU

_IR

Q

FCU_IRQ

FCU_IORD#

FCU_IOWR#

FLASHVCCFLASHVCC

P+5V

DSPVCC33 FLASHVCC

P+5V

DUPRD0DUPTD0

P+5V

DSPVCC33

STB

Y

RAMCKE

RA

MA

DD

8

RA

MC

KE

RESET#

DSPVCC33

OK

_DE

T

CD_DVDCD_DVD''

FPC_DOUTFPC_CLKFPC_STB

C_B_U

Y_R_VCVBS_C

CVBS_G_Y

Y_C_CVBS

ABCLKALRCLK

AMCLK

AP

WM

_LFE

+A

PW

M_L

FE-

FOCUS_STRACK_S

SPDL_SSLED_S

MD

_DV

DM

D_C

D

RF_

FS

PD

L_S

EN

S+

RF_

ES

PD

L_S

EN

S-

RF_

BR

F_A

RF_

DR

F_C

VC

LD_C

DLD

_DV

D

RF

MIC

_VO

CA

L

FS3FS2FS1

IRRCV

AIN

APWM_R+

APWM_L-

APWM_SL-

APWM_L+

APWM_SL+

APWM_R-

APWM_CEN-APWM_CEN+

APWM_SR-APWM_SR+

S/PDIF_OUT

MUTE_CTL

DRVSB

OPENCLOSE

HOMESW

IN_OUT_SW

INSW

STB

Y

CD_DVD

DSPVCC33

DSPVCC33

DSPVCC18

DSPVCC33

DSPVCC33

DSPVCC33

DSPVCC18

DSPVCC33

DSPVCC18

DSPVCC33

P+5V

DSPVCC33

FLASHVCC

DSPVCC33

DSPVCC33

TP29

+ C19110uF/16V

R206 51K

FB8MBW2012-221

CON5

2PIN/2.0

12

R191 10K

U2

SST39VF800

[39VF400/800/160]

123456789

101112131415161718192021222324

484746454443424140393837363534333231302928272625

A15A14A13A12A11A10A9A8NCA20WE#RP#VPPWP#A19A18A17A7A6A5A4A3A2A1

A16VCCQ

GNDDQ15

DQ7DQ14

DQ6DQ13

DQ5DQ12

DQ4VCC

DQ11DQ3

DQ10DQ2DQ9DQ1DQ8DQ0OE#GNDCE#

A0

C171104

TP35

C137 33pF

R180 180R

+C186

100uF/16V

R18

410

0R

TP30

R169 NC/0R

D204148

12

R27033R

R209 22K

+ C185100uF/16V

C164

1nF

TP33

R157 0R

+ C177100uF/16V

C144104

Y427.000MHz

C125104

C154104

C165104

R246 4R7

R170 10K

PH1 1.

TP181

1.

Q8BT3904

1

23

C133104

R2610K

+ C173220uF/16V

D20LL4148

12

TP26

R17

375

R 1

%

R156 0R

FB3

FB

R1782K

R195 0R

C2791nF

C199104

TP28

R16390 Ohm 1%

C127104

+C191

10uF/16V

R2121K

TP43

C18

20.

1uF

C2

0.1UF

R2414k7

R21

575

R 1

%

CON4

2.0X4USB1234

C159

1nF

R23

315

.4K

1%

C202104

TP34

TP45

+ C187100uF/16V

R18356R

R20

875

R 1

%

C181 1nF

R1581M

R2415K

C169104

TP25

FB4

FB

U1A

ZR36962

208

207

206

205

204

203

202

201

200

199

198

197

196

195

194

193

192

191

190

189

188

187

186

185

184

183

182

178

176

179

177

174

175

173

180

181

161

172

163

170

171

167

168

165

166

162

159

160

169

164

158

157

123456789

101112131415161718192021222324252627282930313233343536373839404142

4948

5051

53

52

54 55 5756 58 59 6160 62 63 6564 66 67 69 70 71 7268 73 74 7675 77 78 8079 81 82 8483 85 86 8987 90 91 92

156155154153152151150149148147146145144143142141140139138137136135134133132131130129128127126125124123122121120119118117116115114113112111110109108107106105

44454647

88 93 94 95 96 97 98 99 100

101

102

103

104

43

VD

DP

GP

IO[9

]/ME

MD

AT[

9]M

EM

DA

T[1]

GP

IO[8

]/ME

MD

AT[

8]M

EM

DA

T[0]

ME

MR

D#

ME

MC

S0#

ME

MA

DD

[0]

GP

IO[6

3]/M

EM

CS

2#G

PIO

[62]

/FC

U_I

OR

D#

GP

IO[6

1]/F

CU

_IO

WR

#G

PIO

[60]

/FC

U_S

CLK

GP

IO[5

9]/F

CU

_CS

2#G

PIO

[58]

/FC

U_C

S3#

GP

IO[5

7]/F

CU

_WA

IT#

GP

IO[5

6]/F

CU

_RS

TIG

PIO

[55]

/FC

U_I

RQ

GN

DC

VD

DC

IGP

IO[5

4]/P

WM

CO

[5]

GP

IO[5

3]/P

WM

CO

[4]

GP

IO[5

2]/P

WM

CO

[3]

GP

IO[5

1]/P

WM

CO

[2]

GN

DP

WM

GP

IO[5

0]/P

WM

CO

[1]

VD

DP

WM

GP

IO[4

9]/P

WM

CO

[0]

CD

_MD

GN

DR

EF

DV

D_M

D

VD

DS

AFE

VR

EF

RE

SO

UT

VC

CD

_LD

DV

D_L

D B

GN

D1A

FE CGH KF JE

VD

DA

FE

VD

D1A

FEA

GN

DA

FE D

RFN

RFP

MEMDAT[2]MEMDAT[10]/GPIO[0]MEMDAT[3]MEMDAT[11]/GPIO[1]MEMDAT[4]MEMDAT[12]/GPIO[2]MEMDAT[5]MEMDAT[13]/GPIO[3]MEMDAT[6]MEMDAT[14]/GPIO[4]GNDCMEMDAT[7]MEMDAT[15]VDDCVDDPMEMADD[16]MEMCS1#/GPIO[5]MEMADD[15]MEMADD[14]MEMADD[13]MEMADD[12]MEMADD[11]MEMADD[10]MEMADD[9]MEMADD[8]MEMWR#MEMADD[18]/GPIO[6]MEMADD[17]MEMADD[7]MEMADD[6]GNDCMEMADD[5]MEMADD[4]MEMADD[3]VDDPMEMADD[2]MEMADD[1]MEMADD[19]/IGPIO[7]USBVDDUSBDP/GPO[67]USBDN/GPO[68]USBGND

RAMADD[6]RAMADD[2]

RAMADD[1]RAMADD[7]

RA

MA

DD

[0]

VDDC

RA

MA

DD

[8]

RA

MA

DD

[10]

GN

DC

VD

DP

RA

MA

DD

[9]

RA

MA

DD

[11]

/GP

O[6

4]

RA

MB

AR

AM

CS

0#

RA

MC

S1#

/GP

O[6

5]R

AM

RA

S#

VD

DP

RA

MC

AS

#

GN

DC

RA

MW

E#

GN

DP

CLK

PC

LKV

DD

PC

LKR

AM

DA

T[8]

RA

MD

QM

RA

MD

AT[

7]R

AM

DA

T[9]

VD

DP

RA

MD

AT[

6]

GN

DC

RA

MD

AT[

10]

RA

MD

AT[

11]

RA

MD

AT[

5]

RA

MD

AT[

4]R

AM

DA

T[12

]

VD

DP

RA

MD

AT[

3]

GN

DC

RA

MD

AT[

13]

RA

MD

AT[

14]

RA

MD

AT[

2]

RA

MD

AT[

1]R

AM

DA

T[15

]R

AM

DA

T[0]

GNDDACBS2RSETDAC1

VDDDACDAC2DAC3

VDDDACDAC4

GNDDAC_DDAC5

XINXO

VDDPLLGNDPLLRESET#

GNDCVDDC

GPIO[48]/DUPRD1GPIO[47]/DUPTD1GPIO[46]/DUPRD0

GPIO[45]/PWMCO[5]/DUPTD0VDDP

IGPIO[44]GPIO[43]/TDOGPIO[42]/TCK

GPIO[41]/TDI/NMIGPIO[40]GPIO[39]GPIO[38]

IGPIO[37]/TMS/NMIGPIO[36]GPIO[35]

GPIO[34]/RAMCKE/SPDIFINGPIO[33]/AIN/SPDIFIN

GPIO[32]/SPDIFOGPIO[31]/ABCLK

GPIO[30]/ALRCLKVDDP

GPIO[29]/AMCLKGNDC

GPIO[28]/AOUT[0]/APWM0-GPIO[27]/APWM0+

GPIO[26]/AOUT[1]/APWM1-GPIO[25]/APWM1+

GPIO[24]/AOUT[2]/APWM2-IGPIO[23]/APWM2+

GNDAPWMGPIO[22]/AOUT[3]/APWM3-

GPIO[21]/APWM3+GPIO[20]/APWM4-

GPIO[19]/PWMCO[5]/APWM4+VDDAPWM

RAMADD[3]RAMADD[5]VDDIPGNDC

VD

DC

VD

DP

RA

MD

QM

2/R

AM

CK

E/G

PO

[66]

GN

DC

RA

MC

KE

/SD

I_P

SC

/GP

IO[1

0]G

PA

IO/IG

PIO

[11]

AP

WM

7+/G

PIO

[12]

AP

WM

7-/G

PIO

[13]

AP

WM

6+/G

PIO

[14]

AP

WM

6-/G

PIO

[15]

AP

WM

5+/G

PIO

[16]

AP

WM

5-/G

PIO

[17]

AIN

/SP

DIF

IN/IO

[18]

RAMADD[4]

C150104

C161

27nF

FB5

FB

U6

NC/24C02

1234

8765

A0A1A2

GND

VCCWPSCLSDA

C162104

C14233pF

C167104

R17

475

R 1

%

C139NC/5PF

TP24

TP32

U4

16Mbit: K4S161622C-TC/L70

12345678910111213141516171819202122232425

50494847464544434241403938373635343332313029282726

VD

DD

Q0

DQ

1V

SS

QD

Q2

DQ

3V

DD

QD

Q4

DQ

5V

SS

QD

Q6

DQ

7V

DD

QLD

QM

WE

CA

SR

AS

CS

BA

A10

/AP

A0

A1

A2

A3

VD

D

VS

SD

Q15

DQ

14V

SS

QD

Q13

DQ

12V

DD

QD

Q11

DQ

10V

SS

QD

Q9

DQ

8V

DD

QNC

UD

QM

CLK

CK

EN

CA9

A8

A7

A6

A5

A4

VS

S

JP1NC

1 2

C168 1nF

TP182

1.

R2 1K5

C183104

R23715K

R213 51K

TP38

C157104

C1260.1uF

R19

375

R 1

%

R194 NC

C135 33pF

C160

27nF

R25

4k7

C170104

CON6

SD/MMC/MS

12345678910111213141516

12345678910

111213141516

CON11

4PIN/2.0

1234

TP36

FB1

FB

R23815K

+ C189220uF/16V

R203 10K

C15510nF

FB2 FB

TP31

C145104

R179

2K

C151104

U3

NM[64Mbit:K4S641632H-UC70]

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27282930313233343536373839404142434445464748495051525354

VD

DD

Q0

VD

DQ

DQ

1D

Q2

VS

SQ

DQ

3D

Q4

VD

DQ

DQ

5D

Q6

VS

SQ

DQ

7V

DD

DQ

ML

WE

#C

AS

#R

AS

#C

S#

BA

0B

A1

A10

A0

A1

A2

A3

VD

DV

SSA4

A5

A6

A7

A8

A9

A11NC

CK

EC

LKD

QM

HN

CV

SS

DQ

8V

DD

QD

Q9

DQ

10V

SS

QD

Q11

DQ

12V

DD

QD

Q13

DQ

14V

SS

QD

Q15

VS

S

C122104

R19

010

0R

R188 0R

TP37

R211 51K

+ C180100uF/16V

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

线路图

表格编号：QR-RD-016A

原理框图

U5

TNY275PN

+5V

OPERATIONAL AMPLIFIER

SDRAM

U1

AC IN

5.1CH AUDIO OUTPUT

+3.3V

MOTOR-DRIVER

NJM4558

+1.8V

D5888S

1*16M/4*16M

CD

VFD DRIVER

L

T2

EEL19

ZR36962

FLASH16M

R

PH681

ARIMA

PWM POWER

U7/U8/U9

+12V

VFD DISPLAY

IC1

DSP

100-240V

AUDIO PORT

VIDEO PORT

USB1.1 INPUT

VIDEO PORT

COAXIAL PORT

YUV OUTPUT

DIGTAL COAXIAL OUTPUT

USB PORT

S-VIDEO/CVBS OUTPUT

+5V

-21V

1 OF

Design:

DWG NO.:DV5312-YL01-03

SHEET:

MODEL: DV5312

VER: A

Checked:

1

PART NO.:

DSP+SDRAM+FLASH

Apprd:

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

TITLE:

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

SHEET: 6 pages

PART NO.:

Apprd:

TITLE: Cover page

表格编号：QR-RD-016A

SHEN ZHEN MTC MULTIMEDIA CO.,LTD

Checked:

MODEL: DV5312(ZORAN)Design:

DWG NO.:DV5312-YL01-03

VER: A

TNY274-280TinySwitch-III FamilyEnergy Efficient, Off-Line Switcher with Enhanced Flexibility and Extended Power Range

Figure 1. Typical Standby Application.

Product HighlightsLowest System Cost with Enhanced Flexibility • Simple ON/OFF control, no loop compensation needed• Selectable current limit through BP/M capacitor value - Higher current limit extends peak power or, in open

frame applications, maximum continuous power - Lower current limit improves efficiency in enclosed

adapters/chargers - Allows optimum TinySwitch-III choice by swapping

devices with no other circuit redesign • Tight I2f parameter tolerance reduces system cost - Maximizes MOSFET and magnetics power delivery - Minimizes max overload power, reducing cost of

transformer, primary clamp & secondary components • ON-time extension – extends low line regulation range/

hold-up time to reduce input bulk capacitance• Self-biased: no bias winding or bias components• Frequency jittering reduces EMI filter costs• Pin-out simplifies heatsinking to the PCB • SOURCE pins are electrically quiet for low EMI

Enhanced Safety and Reliability Features• Accurate hysteretic thermal shutdown protection with

automatic recovery eliminates need for manual reset • Improved auto-restart delivers <3% of maximum power

in short circuit and open loop fault conditions• Output overvoltage shutdown with optional Zener • Line under-voltage detect threshold set using a single

optional resistor • Very low component count enhances reliability and

enables single-sided printed circuit board layout• High bandwidth provides fast turn on with no overshoot

and excellent transient load response• Extended creepage between DRAIN and all other pins

improves field reliability

EcoSmart®– Extremely Energy Efficient • Easily meets all global energy efficiency regulations • No-load <150 mW at 265 VAC without bias winding,

<50 mW with bias winding• ON/OFF control provides constant efficiency down to

very light loads – ideal for mandatory CEC regulations and 1 W PC standby requirements

Applications• Chargers/adapters for cell/cordless phones, PDAs, digital

cameras, MP3/portable audio, shavers, etc.

®

February 2006

Table 1. Notes: 1. Minimum continuous power in a typical non-ventilated enclosed adapter measured at 50 °C ambient. Use of an external heatsink will increase power capability 2. Minimum peak power capability in any design or minimum continuous power in an open frame design (see Key Application Considerations). 3. Packages: P: DIP-8C, G: SMD-8C. See Part Ordering Information.

• PC Standby and other auxiliary supplies• DVD/PVR and other low power set top decoders• Supplies for appliances, industrial systems, metering, etc.

DescriptionTinySwitch-III incorporates a 700 V power MOSFET, oscillator, high voltage switched current source, current limit (user selectable) and thermal shutdown circuitry. The IC family uses an ON/OFF control scheme and offers a design flexible solution with a low system cost and extended power capability.

OUTPUT POWER TABLE

PRODUCT3

230 VAC ±15% 85-265 VAC

Adapter1Peak or Open

Frame2Adapter1

Peak or Open

Frame2

TNY274 P or G 6 W 11 W 5 W 8.5 WTNY275 P or G 8.5 W 15 W 6 W 11.5 WTNY276 P or G 10 W 19 W 7 W 15 WTNY277 P or G 13 W 23.5 W 8 W 18 WTNY278 P or G 16 W 28 W 10 W 21.5 WTNY279 P or G 18 W 32 W 12 W 25 WTNY280 P or G 20 W 36.5 W 14 W 28.5 W

PI-4095-082205

Wide-RangeHV DC Input

D

S

EN/UV

BP/M

+

-

+

-

DCOutput

TinySwitch-III

2 E2/06

TNY274-280

Figure 2. Functional Block Diagram.

Figure 3. Pin Configuration.

Pin Functional DescriptionDRAIN (D) Pin:This pin is the power MOSFET drain connection. It provides internal operating current for both start-up and steady-state operation.

BYPASS/MULTI-FUNCTION (BP/M) Pin:This pin has multiple functions:

1. It is the connection point for an external bypass capacitor for the internally generated 5.85 V supply.

2. It is a mode selector for the current limit value, depending on the value of the capacitance added. Use of a 0.1 µF capacitor results in the standard current limit value. Use of a 1 µF capacitor results in the current limit being reduced to that of the next smaller device size. Use of a 10 µF capacitor results in the current limit being increased to that of the next larger device size for TNY275-280.

3. It provides a shutdown function. When the current into the bypass pin exceeds 5.5 mA, the device latches off until the BP/M voltage drops below 4.9 V, during a power down. This can be used to provide an output overvoltage function

with a Zener connected from the BP/M pin to a bias winding supply.

ENABLE/UNDER-VOLTAGE (EN/UV) Pin:This pin has dual functions: enable input and line under-voltage sense. During normal operation, switching of the power

PI-4077-013106

CLOCK

OSCILLATOR

5.85 V4.9 V

SOURCE(S)

S

R

Q

DCMAX

BYPASS/MULTI-FUNCTION

(BP/M)

+

-

VILIMIT

FAULTPRESENT

CURRENT LIMITCOMPARATOR

ENABLE

LEADINGEDGE

BLANKING

THERMALSHUTDOWN

+

-

DRAIN(D)

REGULATOR5.85 V

BYPASS PINUNDER-VOLTAGE

1.0 V + VT

ENABLE/UNDER-

VOLTAGE(EN/UV)

Q

115 µA 25 µALINE UNDER-VOLTAGE

RESET

AUTO-RESTARTCOUNTER

JITTER

1.0 V

6.4 V

CURRENTLIMIT STATE

MACHINE

PI-4078-080905

D S

BP/M S

SEN/UV

P Package (DIP-8C)G Package (SMD-8C)

8

5

7

1

4

2

S6

3

TNY274-280

E2/06

Figure 4. Frequency Jitter.

MOSFET is controlled by this pin. MOSFET switching is terminated when a current greater than a threshold current is drawn from this pin. Switching resumes when the current being pulled from the pin drops to less than a threshold current. A modulation of the threshold current reduces group pulsing. The threshold current is between 60 µA and 115 µA.

The EN/UV pin also senses line under-voltage conditions through an external resistor connected to the DC line voltage. If there is no external resistor connected to this pin, TinySwitch-III detects its absence and disables the line under-voltage function.

SOURCE (S) Pin:This pin is internally connected to the output MOSFET source for high voltage power return and control circuit common.

TinySwitch-III Functional DescriptionTinySwitch-III combines a high voltage power MOSFET switch with a power supply controller in one device. Unlike conventional PWM (pulse width modulator) controllers, it uses a simple ON/OFF control to regulate the output voltage.

The controller consists of an oscillator, enable circuit (sense and logic), current limit state machine, 5.85 V regulator, BYPASS/MULTI-FUNCTION pin under-voltage, overvoltage circuit, and current limit selection circuitry, over- temperature protection, current limit circuit, leading edge blanking, and a 700 V power MOSFET. TinySwitch-III incorporates additional circuitry for line under-voltage sense, auto-restart, adaptive switching cycle on-time extension, and frequency jitter. Figure 2 shows the functional block diagram with the most important features.

OscillatorThe typical oscillator frequency is internally set to an average of 132 kHz. Two signals are generated from the oscillator: the

maximum duty cycle signal (DCMAX) and the clock signal that indicates the beginning of each cycle.

The oscillator incorporates circuitry that introduces a small amount of frequency jitter, typically 8 kHz peak-to-peak, to minimize EMI emission. The modulation rate of the frequency jitter is set to 1 kHz to optimize EMI reduction for both average and quasi-peak emissions. The frequency jitter should be measured with the oscilloscope triggered at the falling edge of the DRAIN waveform. The waveform in Figure 4 illustrates the frequency jitter.

Enable Input and Current Limit State MachineThe enable input circuit at the EN/UV pin consists of a low impedance source follower output set at 1.2 V. The current through the source follower is limited to 115 µA. When the current out of this pin exceeds the threshold current, a low logic level (disable) is generated at the output of the enable circuit, until the current out of this pin is reduced to less than the threshold current. This enable circuit output is sampled at the beginning of each cycle on the rising edge of the clock signal. If high, the power MOSFET is turned on for that cycle (enabled). If low, the power MOSFET remains off (disabled). Since the sampling is done only at the beginning of each cycle, subsequent changes in the EN/UV pin voltage or current during the remainder of the cycle are ignored.

The current limit state machine reduces the current limit by discrete amounts at light loads when TinySwitch-III is likely to switch in the audible frequency range. The lower current limit raises the effective switching frequency above the audio range and reduces the transformer flux density, including the associated audible noise. The state machine monitors the sequence of enable events to determine the load condition and adjusts the current limit level accordingly in discrete amounts.

Under most operating conditions (except when close to no-load), the low impedance of the source follower keeps the voltage on the EN/UV pin from going much below 1.2 V in the disabled state. This improves the response time of the optocoupler that is usually connected to this pin.

5.85 V Regulator and 6.4 V Shunt Voltage ClampThe 5.85 V regulator charges the bypass capacitor connected to the BYPASS pin to 5.85 V by drawing a current from the voltage on the DRAIN pin whenever the MOSFET is off. The BYPASS/MULTI-FUNCTION pin is the internal supply voltage node. When the MOSFET is on, the device operates from the energy stored in the bypass capacitor. Extremely low power consumption of the internal circuitry allows TinySwitch-III to operate continuously from current it takes from the DRAIN pin. A bypass capacitor value of 0.1 µF is sufficient for both high frequency decoupling and energy storage.

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In addition, there is a 6.4 V shunt regulator clamping the BYPASS/MULTI-FUNCTION pin at 6.4 V when current is provided to the BYPASS/MULTI-FUNCTION pin through an external resistor. This facilitates powering of TinySwitch-III externally through a bias winding to decrease the no-load consumption to well below 50 mW.

BYPASS/MULTI-FUNCTION Pin Under-VoltageThe BYPASS/MULTI-FUNCTION pin under-voltage circuitry disables the power MOSFET when the BYPASS/MULTI-FUNCTION pin voltage drops below 4.9 V in steady state operation. Once the BYPASS/MULTI-FUNCTION pin voltage drops below 4.9 V in steady state operation, it must rise back to 5.85 V to enable (turn-on) the power MOSFET.

Over Temperature ProtectionThe thermal shutdown circuitry senses the die temperature. The threshold is typically set at 142 °C with 75 °C hysteresis. When the die temperature rises above this threshold the power MOSFET is disabled and remains disabled until the die temperature falls by 75 °C, at which point it is re-enabled. A large hysteresis of 75 °C (typical) is provided to prevent overheating of the PC board due to a continuous fault condition.

Current LimitThe current limit circuit senses the current in the power MOSFET. When this current exceeds the internal threshold (ILIMIT), the power MOSFET is turned off for the remainder of that cycle. The current limit state machine reduces the current limit threshold by discrete amounts under medium and light loads.

The leading edge blanking circuit inhibits the current limit comparator for a short time (tLEB) after the power MOSFET is turned on. This leading edge blanking time has been set so that current spikes caused by capacitance and secondary-side rectifier reverse recovery time will not cause premature termination of the switching pulse.

Auto-RestartIn the event of a fault condition such as output overload, output short circuit, or an open loop condition, TinySwitch-III enters into auto-restart operation. An internal counter clocked by the oscillator is reset every time the EN/UV pin is pulled low. If the EN/UV pin is not pulled low for 64 ms, the power MOSFET switching is normally disabled for 2.5 seconds (except in the case of line under-voltage condition, in which case it is disabled until the condition is removed). The auto-restart alternately enables and disables the switching of the power MOSFET until the fault condition is removed. Figure 5 illustrates auto-restart circuit operation in the presence of an output short circuit.

In the event of a line under-voltage condition, the switching of the power MOSFET is disabled beyond its normal 2.5 seconds until the line under-voltage condition ends.

Adaptive Switching Cycle On-Time ExtensionAdaptive switching cycle on-time extension keeps the cycle on until current limit is reached, instead of prematurely terminating after the DCMAX signal goes low. This feature reduces the minimum input voltage required to maintain regulation, extending hold-up time and minimizing the size of bulk capacitor required. The on-time extension is disabled during the startup of the power supply, until the power supply output reaches regulation.

Line Under-Voltage Sense CircuitThe DC line voltage can be monitored by connecting an external resistor from the DC line to the EN/UV pin. During power-up or when the switching of the power MOSFET is disabled in auto-restart, the current into the EN/UV pin must exceed 25 µA to initiate switching of the power MOSFET. During power-up, this is accomplished by holding the BYPASS/MULTI-FUNCTION pin to 4.9 V while the line under-voltage condition exists. The BYPASS/MULTI-FUNCTION pin then rises from 4.9 V to 5.85 V when the line under-voltage condition goes away. When the switching of the power MOSFET is disabled in auto-restart mode and a line under-voltage condition exists, the auto-restart counter is stopped. This stretches the disable time beyond its normal 2.5 seconds until the line under-voltage condition ends.

The line under-voltage circuit also detects when there is no external resistor connected to the EN/UV pin (less than ~1 µA into the pin). In this case the line under-voltage function is disabled.

TinySwitch-III Operation

TinySwitch-III devices operate in the current limit mode. When enabled, the oscillator turns the power MOSFET on at the beginning of each cycle. The MOSFET is turned off when the current ramps up to the current limit or when the DCMAX limit is reached. Since the highest current limit level and frequency of a TinySwitch-III design are constant, the power delivered to the

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Figure 6. Operation at Near Maximum Loading.

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Figure 8. Operation at Medium Loading.Figure 7. Operation at Moderately Heavy Loading.

load is proportional to the primary inductance of the transformer and peak primary current squared. Hence, designing the supply involves calculating the primary inductance of the transformer for the maximum output power required. If the TinySwitch-III is appropriately chosen for the power level, the current in the calculated inductance will ramp up to current limit before the DCMAX limit is reached.

Enable FunctionTinySwitch-III senses the EN/UV pin to determine whether or

not to proceed with the next switching cycle. The sequence of cycles is used to determine the current limit. Once a cycle is started, it always completes the cycle (even when the EN/UV pin changes state half way through the cycle). This operation results in a power supply in which the output voltage ripple is determined by the output capacitor, amount of energy per switch cycle and the delay of the feedback.

The EN/UV pin signal is generated on the secondary by comparing the power supply output voltage with a reference voltage. The EN/UV pin signal is high when the power supply output voltage is less than the reference voltage.

In a typical implementation, the EN/UV pin is driven by an optocoupler. The collector of the optocoupler transistor is connected to the EN/UV pin and the emitter is connected to the SOURCE pin. The optocoupler LED is connected in series with a Zener diode across the DC output voltage to be regulated. When the output voltage exceeds the target regulation voltage level (optocoupler LED voltage drop plus Zener voltage), the optocoupler LED will start to conduct, pulling the EN/UV pin low. The Zener diode can be replaced by a TL431 reference circuit for improved accuracy.

ON/OFF Operation with Current Limit State MachineThe internal clock of the TinySwitch-III runs all the time. At the beginning of each clock cycle, it samples the EN/UV pin to decide whether or not to implement a switch cycle, and based on the sequence of samples over multiple cycles, it determines the appropriate current limit. At high loads, the state machine sets the current limit to its highest value. At lighter loads, the state machine sets the current limit to reduced values.

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Figure 12. Normal Power-Down Timing (without UV).

Figure 13. Slow Power-Down Timing with Optional External (4 MΩ) UV Resistor Connected to EN/UV Pin.

Figure 10. Power-Up with Optional External UV Resistor (4 MΩ) Connected to EN/UV Pin.

Figure 11. Power-Up Without Optional External UV Resistor Connected to EN/UV Pin.

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Figure 9. Operation at Very Light Load.

At near maximum load, TinySwitch-III will conduct during nearly all of its clock cycles (Figure 6). At slightly lower load, it will “skip” additional cycles in order to maintain voltage regulation at the power supply output (Figure 7). At medium loads, cycles will be skipped and the current limit will be reduced (Figure 8). At very light loads, the current limit will be reduced even further (Figure 9). Only a small percentage of cycles will occur to satisfy the power consumption of the power supply.

The response time of the ON/OFF control scheme is very fast compared to PWM control. This provides tight regulation and excellent transient response.

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Power Up/DownThe TinySwitch-III requires only a 0.1 µF capacitor on the BYPASS/MULTI-FUNCTION pin to operate with standard current limit. Because of its small size, the time to charge this capacitor is kept to an absolute minimum, typically 0.6 ms. The time to charge will vary in proportion to the BYPASS/MULTI-FUNCTION pin capacitor value when selecting different current limits. Due to the high bandwidth of the ON/OFF feedback, there is no overshoot at the power supply output. When an external resistor (4 MΩ) is connected from the positive DC input to the EN/UV pin, the power MOSFET switching will be delayed during power-up until the DC line voltage exceeds the threshold (100 V). Figures 10 and 11 show the power-up timing waveform in applications with and without an external resistor (4 MΩ) connected to the EN/UV pin.

Under startup and overload conditions, when the conduction time is less than 400 ns, the device reduces the switching frequency to maintain control of the peak drain current.

During power-down, when an external resistor is used, the power MOSFET will switch for 64 ms after the output loses regulation. The power MOSFET will then remain off without any glitches since the under-voltage function prohibits restart when the line voltage is low.

Figure 12 illustrates a typical power-down timing waveform. Figure 13 illustrates a very slow power-down timing waveform as in standby applications. The external resistor (4 MΩ) is connected to the EN/UV pin in this case to prevent unwanted restarts.

No bias winding is needed to provide power to the chip because it draws the power directly from the DRAIN pin (see

Functional Description above). This has two main benefits. First, for a nominal application, this eliminates the cost of a bias winding and associated components. Secondly, for battery charger applications, the current-voltage characteristic often allows the output voltage to fall close to zero volts while still delivering power. TinySwitch-III accomplishes this without a forward bias winding and its many associated components. For applications that require very low no-load power consumption (50 mW), a resistor from a bias winding to the BYPASS/MULTI-FUNCTION pin can provide the power to the chip. The minimum recommended current supplied is 1 mA. The BYPASS/MULTI-FUNCTION pin in this case will be clamped at 6.4 V. This method will eliminate the power draw from the DRAIN pin, thereby reducing the no-load power consumption and improving full-load efficiency.

Current Limit OperationEach switching cycle is terminated when the DRAIN current reaches the current limit of the device. Current limit operation provides good line ripple rejection and relatively constant power delivery independent of input voltage.

BYPASS/MULTI-FUNCTION Pin CapacitorThe BYPASS/MULTI-FUNCTION pin can use a ceramic capacitor as small as 0.1 µF for decoupling the internal power supply of the device. A larger capacitor size can be used to adjust the current limit. For TNY275-280, a 1 µF BP/M pin capacitor will select a lower current limit equal to the standard current limit of the next smaller device and a 10 µF BP/M pin capacitor will select a higher current limit equal to the standard current limit of the next larger device. The higher current limit level of the TNY280 is set to 850 mA typical. The TNY274 MOSFET does not have the capability for increased current limit so this feature is not available in this device.

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Applications ExampleThe circuit shown in Figure 14 is a low cost, high efficiency, flyback power supply designed for 12 V, 1 A output from universal input using the TNY278.

The supply features under-voltage lockout, primary sensed output overvoltage latching shutdown protection, high efficiency (>80%), and very low no-load consumption (<50 mW at 265 VAC). Output regulation is accomplished using a simple zener reference and optocoupler feedback.

The rectified and filtered input voltage is applied to the primary winding of T1. The other side of the transformer primary is driven by the integrated MOSFET in U1. Diode D5, C2, R1, R2, and VR1 comprise the clamp circuit, limiting the leakage inductance turn-off voltage spike on the DRAIN pin to a safe value. The use of a combination a Zener clamp and parallel RC optimizes both EMI and energy efficiency. Resistor R2 allows the use of a slow recovery, low cost, rectifier diode by limiting the reverse current through D5. The selection of a slow diode also improves efficiency and conducted EMI but should be a glass passivated type, with a specified recovery time of ≤2 µs.

The output voltage is regulated by the Zener diode VR3. When the output voltage exceeds the sum of the Zener and optocoupler

LED forward drop, current will flow in the optocoupler LED. This will cause the transistor of the optocoupler to sink current.When this current exceeds the ENABLE pin threshold current the next switching cycle is inhibited. When the output voltage falls below the feedback threshold, a conduction cycle is allowed to occur and, by adjusting the number of enabled cycles, output regulation is maintained. As the load reduces, the number of enabled cycles decreases, lowering the effective switching frequency and scaling switching losses with load. This provides almost constant efficiency down to very light loads, ideal for meeting energy efficiency requirements.

As the TinySwitch-III devices are completely self-powered, there is no requirement for an auxiliary or bias winding on the transformer. However by adding a bias winding, the output overvoltage protection feature can be configured, protecting the load against open feedback loop faults.

When an overvoltage condition occurs, such that bias voltage exceeds the sum of VR2 and the BYPASS/MULTIFUNCTION (BP/M) pin voltage (28 V+5.85 V), current begins to flow into the BP/M pin. When this current exceeds 5 mA the internal latching shutdown circuit in TinySwitch-III is activated. This condition is reset when the BP/M pin voltage drops below 2.6 V after removal of the AC input. In the example shown, on opening the loop, the OVP trips at an output of 17 V.

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Figure 14. TNY278P, 12 V, 1 A Universal Input Power Supply.

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For lower no-load input power consumption, the bias winding may also be used to supply the TinySwitch-III device. Resistor R8 feeds current into the BP/M pin, inhibiting the internal high voltage current source that normally maintains the BP/M pin capacitor voltage (C7) during the internal MOSFET off time. This reduces the no-load consumption of this design from 140 mW to 40 mW at 265 VAC.

Under-voltage lockout is configured by R5 connected between the DC bus and EN/UV pin of U1. When present, switching is inhibited until the current in the EN/UV pin exceeds 25 µA. This allows the startup voltage to be programmed within the normal operating input voltage range, preventing glitching of the output under abnormal low voltage conditions and also on removal of the AC input.

In addition to the simple input pi filter (C1, L1, C2) for differential mode EMI, this design makes use of E-Shield™ shielding techniques in the transformer to reduce common mode EMI displacement currents, and R2 and C4 as a damping network to reduce high frequency transformer ringing. These techniques, combined with the frequency jitter of TNY278, give excellent conducted and radiated EMI performance with this design achieving >12 dBµV of margin to EN55022 Class B conducted EMI limits.

For design flexibility the value of C7 can be selected to pick one of the 3 current limits options in U1. This allows the designer to select the current limit appropriate for the application.

• Standard current limit (ILIMIT) is selected with a 0.1 µF BP/M pin capacitor and is the normal choice for typical enclosed adapter applications.

• When a 1 µF BP/M pin capacitor is used, the current limit is reduced (ILIMITred or ILIMIT-1) offering reduced RMS device currents and therefore improved efficiency, but at the expense of maximum power capability. This is ideal for thermally challenging designs where dissipation must be minimized.

• When a 10 µF BP/M pin capacitor is used, the current limit is increased (ILIMITinc or ILIMIT+1), extending the power capability for applications requiring higher peak power or continuous power where the thermal conditions allow.

Further flexibility comes from the current limits between adjacent TinySwitch-III family members being compatible. The reduced current limit of a given device is equal to the standard current limit of the next smaller device and the increased current limit is equal to the standard current limit of the next larger device.

Key Application ConsiderationsTinySwitch-lll Design Considerations

Output Power TableThe data sheet output power table (Table 1) represents the minimum practical continuous output power level that can be obtained under the following assumed conditions:

1. The minimum DC input voltage is 100 V or higher for 85 VAC input, or 220 V or higher for 230 VAC input or 115 VAC with a voltage doubler. The value of the input capacitance should be sized to meet these criteria for AC input designs.

2. Efficiency of 75%.3. Minimum data sheet value of I2f.4. Transformer primary inductance tolerance of ±10%.5. Reflected output voltage (VOR) of 135 V.6. Voltage only output of 12 V with a fast PN rectifier diode.7. Continuous conduction mode operation with transient KP*

value of 0.25.8. Increased current limit is selected for peak and open frame

power columns and standard current limit for adapter columns.

9. The part is board mounted with SOURCE pins soldered to a sufficient area of copper and/or a heatsink is used to keep the SOURCE pin temperature at or below 110 °C.

10. Ambient temperature of 50 °C for open frame designs and 40 °C for sealed adapters.

*Below a value of 1, KP is the ratio of ripple to peak primary current. To prevent reduced power capability due to premature termination of switching cycles a transient KP limit of ≥0.25 is recommended. This prevents the initial current limit (IINIT) from being exceeded at MOSFET turn on.

For reference, Table 2 provides the minimum practical power delivered from each family member at the three selectable current limit values. This assumes open frame operation (not thermally limited) and otherwise the same conditions as listed above. These numbers are useful to identify the correct current limit to select for a given device and output power requirement.

Overvoltage ProtectionThe output overvoltage protection provided by TinySwitch-III uses an internal latch that is triggered by a threshold current of approximately 5.5 mA into the BP/M pin. In addition to an internal filter, the BP/M pin capacitor forms an external filter providing noise immunity from inadvertent triggering. For the bypass capacitor to be effective as a high frequency filter, the capacitor should be located as close as possible to the SOURCE and BP/M pins of the device.

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For best performance of the OVP function, it is recommended that a relatively high bias winding voltage is used, in the range of 15 V-30 V. This minimizes the error voltage on the bias winding due to leakage inductance and also ensures adequate voltage during no-load operation from which to supply the BP/M pin for reduced no-load consumption.

Selecting the Zener diode voltage to be approximately 6 V above the bias winding voltage (28 V for 22 V bias winding) gives good OVP performance for most designs, but can be adjusted to compensate for variations in leakage inductance. Adding additional filtering can be achieved by inserting a low value (10 Ω to 47 Ω) resistor in series with the bias winding diode and/or the OVP Zener as shown by R7 and R3 in Figure 14. The resistor in series with the OVP Zener also limits the maximum current into the BP/M pin.

Reducing No-load ConsumptionAs TinySwitch-III is self-powered from the BP/M pin capacitor, there is no need for an auxillary or bias winding to be provided on the transformer for this purpose. Typical no-load consumption when self-powered is <150 mW at 265 VAC input. The addition of a bias winding can reduce this down to <50 mW by supplying the TinySwitch-III from the lower bias voltage and inhibiting the internal high voltage current source. To achieve this, select the value of the resistor (R8 in Figure 14) to provide the data sheet DRAIN supply current. In practice, due to the reduction of the bias voltage at low load, start with a value equal to 40% greater than the data sheet maximum current, and then increase the value of the resistor to give the lowest no-load consumption.

Audible NoiseThe cycle skipping mode of operation used in TinySwitch-III can generate audio frequency components in the transformer. To limit this audible noise generation the transformer should be designed such that the peak core flux density is below 3000 Gauss (300 mT). Following this guideline and using the standard transformer production technique of dip varnishing

practically eliminates audible noise. Vacuum impregnation of the transformer should not be used due to the high primary capacitance and increased losses that result. Higher flux densities are possible, however careful evaluation of the audible noise performance should be made using production transformer samples before approving the design.

Ceramic capacitors that use dielectrics such as Z5U, when used in clamp circuits, may also generate audio noise. If this is the case, try replacing them with a capacitor having a different dielectric or construction, for example a film type.

TinySwitch-lll Layout Considerations

LayoutSee Figure 15 for a recommended circuit board layout for TinySwitch-III.

Single Point GroundingUse a single point ground connection from the input filter capacitor to the area of copper connected to the SOURCE pins.

Bypass Capacitor (CBP)The BP/M pin capacitor should be located as near as possible to the BP/M and SOURCE pins.

Primary Loop AreaThe area of the primary loop that connects the input filter capacitor, transformer primary and TinySwitch-III together should be kept as small as possible.

Primary Clamp CircuitA clamp is used to limit peak voltage on the DRAIN pin at turn off. This can be achieved by using an RCD clamp or a Zener (~200 V) and diode clamp across the primary winding. In all cases, to minimize EMI, care should be taken to minimize the circuit path from the clamp components to the transformer and TinySwitch-III.

OUTPUT POWER TABLE

PRODUCT230 VAC ±15% 85-265 VAC

ILIMIT-1 ILIMIT ILIMIT+1 ILIMIT-1 ILIMIT ILIMIT+1

TNY274 P or G 9 10.9 9.1 7.1 8.5 7.1TNY275 P or G 10.8 12 15.1 8.4 9.3 11.8TNY276 P or G 11.8 15.3 19.4 9.2 11.9 15.1TNY277 P or G 15.1 19.6 23.7 11.8 15.3 18.5TNY278 P or G 19.4 24 28 15.1 18.6 21.8TNY279 P or G 23.7 28.4 32.2 18.5 22 25.2TNY280 P or G 28 32.7 36.6 21.8 25.4 28.5

Table 2. Minimum Practical Power at Three Selectable Current Limit Levels.

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Thermal ConsiderationsThe four SOURCE pins are internally connected to the IC lead frame and provide the main path to remove heat from the device. Therefore all the SOURCE pins should be connected to a copper area underneath the TinySwitch-III to act not only as a single point ground, but also as a heatsink. As this area is connected to the quiet source node, this area should be maximized for good heatsinking. Similarly for axial output diodes, maximize the PCB area connected to the cathode.

Y-CapacitorThe placement of the Y-capacitor should be directly from the primary input filter capacitor positive terminal to the common/return terminal of the transformer secondary. Such a placement will route high magnitude common mode surge currents away from the TinySwitch-III device. Note – if an input π (C, L, C) EMI filter is used then the inductor in the filter should be placed between the negative terminals of the input filter capacitors.

OptocouplerPlace the optocoupler physically close to the TinySwitch-III to minimizing the primary-side trace lengths. Keep the high current, high voltage drain and clamp traces away from the optocoupler to prevent noise pick up.

Output DiodeFor best performance, the area of the loop connecting the secondary winding, the output diode and the output filter capacitor, should be minimized. In addition, sufficient copper area should be provided at the anode and cathode terminals of the diode for heatsinking. A larger area is preferred at the quiet cathode terminal. A large anode area can increase high frequency radiated EMI.

Figure 15. Recommended Circuit Board Layout for TinySwitch-III with Under-Voltage Lock Out Resistor.

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Quick Design Checklist

As with any power supply design, all TinySwitch-III designs should be verified on the bench to make sure that component specifications are not exceeded under worst case conditions. The following minimum set of tests is strongly recommended:

1. Maximum drain voltage – Verify that VDS does not exceed 650 V at highest input voltage and peak (overload) output power. The 50 V margin to the 700 V BVDSS specification gives margin for design variation.

2. Maximum drain current – At maximum ambient temperature, maximum input voltage and peak output (overload) power, verify drain current waveforms for any signs of transformer saturation and excessive leading edge current spikes at

startup. Repeat under steady state conditions and verify that the leading edge current spike event is below ILIMIT(Min) at the end of the tLEB(Min). Under all conditions, the maximum drain current should be below the specified absolute maximum ratings.

3. Thermal Check – At specified maximum output power, minimum input voltage and maximum ambient temperature, verify that the temperature specifications are not exceeded for TinySwitch-III, transformer, output diode, and output capacitors. Enough thermal margin should be allowed for part-to-part variation of the RDS(ON) of TinySwitch-III as specified in the data sheet. Under low line, maximum power, a maximum TinySwitch-III SOURCE pin temperature of 110 °C is recommended to allow for these variations.

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Parameter SymbolConditions

SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16

(Unless Otherwise Specified)

Min Typ Max Units

CONTROL FUNCTIONSOutput Frequency in Standard Mode fOSC

TJ = 25 °C See Figure 4

Average 124 132 140kHz

Peak-Peak Jitter 8

Maximum Duty Cycle DCMAX S1 Open 62 65 %

EN/UV Pin Upper Turnoff Threshold Current

IDIS -150 -115 -90 µA

EN/UV Pin Voltage VEN

IEN/UV = 25 µA 1.8 2.2 2.6V

IEN/UV = -25 µA 0.8 1.2 1.6

DRAIN Supply Current

IS1EN/UV Current > IDIS (MOSFET Not

Switching) See Note A 290 µA

IS2

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Switching at fOSC) See Note B

TNY274 275 360

µA

TNY275 295 400TNY276 310 430TNY277 365 460TNY278 445 540TNY279 510 640TNY280 630 760

ABSOLUTE MAXIMUM RATINGS(1,5)

DRAIN Voltage .................................. ..............-0.3 V to 700 V DRAIN Peak Current: TNY274.......................400 (750) mA(2) TNY275.....................560 (1050) mA(2) TNY276.....................720 (1350) mA(2) TNY277.....................880 (1650) mA(2) TNY278...................1040 (1950) mA(2)

TNY279 ................. 1200 (2250) mA(2)

TNY280 ................. 1360 (2550) mA(2) EN/UV Voltage ................................................... -0.3 V to 9 V EN/UV Current ........................................................... 100 mA BP/M Voltage .................................................. ....-0.3 V to 9 V Storage Temperature ......................................-65 °C to 150 °C Operating Junction Temperature(3) .................-40 °C to 150 °C

Lead Temperature(4) ....................................................... 260 °C Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. 2. The higher peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 3. Normally limited by internal circuitry. 4. 1/16 in. from case for 5 seconds. 5. Maximum ratings specified may be applied one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability.

THERMAL IMPEDANCE

Thermal Impedance: P or G Package: (θJA) ........................... 70 °C/W(2); 60 °C/W(3)

(θJC)(1) ............................................... 11 °C/W

Notes: 1. Measured on the SOURCE pin close to plastic interface. 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.

14 E2/06

TNY274-280

Parameter SymbolConditions

SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16

(Unless Otherwise Specified)

Min Typ Max Units

CONTROL FUNCTIONS (cont.)

BP/M Pin Charge Current

ICH1

VBP/M = 0 V, TJ = 25 °C

See Note C, D

TNY274 -6 -3.8 -1.8

mA

TNY275-279 -8.3 -5.4 -2.5

TNY280 -9.7 -6.8 -3.9

ICH2

VBP/M = 4 V, TJ = 25 °C

See Note C, D

TNY274 -4.1 -2.3 -1

TNY275-279 -5 -3.5 -1.5

TNY280 -6.6 -4.6 -2.1

BP/M Pin Voltage VBP/M See Note C 5.6 5.85 6.15 V

BP/M Pin Voltage Hysteresis VBP/MH 0.80 0.95 1.20 V

BP/M Pin Shunt Voltage VSHUNT IBP = 2 mA 6.0 6.4 6.7 V

EN/UV Pin Line Under-Voltage Threshold

ILUV TJ = 25 °C 22.5 25 27.5 µA

CIRCUIT PROTECTION

Standard Current Limit (BP/M Capacitor = 0.1 µF) See Note D

ILIMIT

TNY274 TJ = 25 °C

di/dt = 50 mA/µs See Note E 233 250 267

mA

TNY275 TJ = 25 °C

di/dt = 55 mA/µs See Note E 256 275 294

TNY276 TJ = 25 °C

di/dt = 70 mA/µs See Note E 326 350 374

TNY277 TJ = 25 °C

di/dt = 90 mA/µs See Note E 419 450 481

TNY278 TJ = 25 °C

di/dt = 110 mA/µs See Note E 512 550 588

TNY279 TJ = 25 °C

di/dt = 130 mA/µs See Note E 605 650 695

TNY280 TJ = 25 °C

di/dt = 150 mA/µs See Note E 698 750 802

Reduced Current Limit (BP/M Capacitor = 1 µF)

ILIMITred

TNY274 TJ = 25 °C

di/dt = 50 mA/µs See Note E 196 210 233

mATNY275

TJ = 25 °Cdi/dt = 55 mA/µs

See Note E 233 250 277

15

TNY274-280

E2/06

Parameter SymbolConditions

SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16

(Unless Otherwise Specified)

Min Typ Max Units

CIRCUIT PROTECTION (cont.)

Reduced Current Limit (BP/M Capacitor = 1 µF) See Note D

ILIMITred

TNY276 TJ = 25 °C

di/dt = 70 mA/µs See Note E 256 275 305

mA

TNY277 TJ = 25 °C

di/dt = 90 mA/µs See Note E 326 350 388

TNY278 TJ = 25 °C

di/dt = 110 mA/µs See Note E 419 450 499

TNY279 TJ = 25 °C

di/dt = 130 mA/µs See Note E 512 550 610

TNY280 TJ = 25 °C

di/dt = 150 mA/µs See Note E 605 650 721

Increased Current Limit (BP/M Capacitor = 10 µF) See Note D

ILIMITinc

TNY274 TJ = 25 °C

di/dt = 50 mA/µs See Note E, F 196 210 233

mA

TNY275 TJ = 25 °C

di/dt = 55 mA/µs See Note E 326 350 388

TNY276 TJ = 25 °C

di/dt = 70 mA/µs See Note E 419 450 499

TNY277 TJ = 25 °C

di/dt = 90 mA/µs See Note E 512 550 610

TNY278 TJ = 25 °C

di/dt = 110 mA/µs See Note E 605 650 721

TNY279 TJ = 25 °C

di/dt = 130 mA/µs See Note E 698 750 833

TNY280 TJ = 25 °C

di/dt = 150 mA/µs See Note E 791 850 943

Power Coefficient I2f I2f = ILIMIT(TYP)2 ×

fOSC(TYP)

Standard Current Limit

0.9 × I2f I2f 1.12 ×

I2fA2HzReduced or

Increased Current Limit

0.9 × I2f I2f 1.16 ×

I2f

Initial Current Limit IINITSee Figure 19

TJ = 25 °C, See Note G0.75 × ILIMIT(MIN)

mA

Leading Edge Blanking Time tLEB

TJ = 25 °C See Note G 170 215 ns

Current Limit Delay tILD

TJ = 25 °C See Note G, H 150 ns

Thermal Shutdown Temperature TSD 135 142 150 °C

16 E2/06

TNY274-280

Parameter SymbolConditions

SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16

(Unless Otherwise Specified)

Min Typ Max Units

CIRCUIT PROTECTION (cont.)Thermal Shut-down Hysteresis TSDH 75 °C

BP/M Pin Shut-down Threshold Current

ISD 4 5.5 7.5 mA

BP/M Pin Power-Up Reset Thresh-old Voltage

VBP/M(RESET) 1.6 2.6 3.6 V

OUTPUT

ON-State Resistance RDS(ON)

TNY274 ID = 25 mA

TJ = 25 °C 28 32

Ω

TJ = 100 °C 42 48

TNY275 ID = 28 mA

TJ = 25 °C 19 22

TJ = 100 °C 29 33

TNY276 ID = 35 mA

TJ = 25 °C 14 16

TJ = 100 °C 21 24

TNY277 ID = 45 mA

TJ = 25 °C 7.8 9.0

TJ = 100 °C 11.7 13.5

TNY278 ID = 55 mA

TJ = 25 °C 5.2 6.0

TJ = 100 °C 7.8 9.0

TNY279 ID = 65 mA

TJ = 25 °C 3.9 4.5

TJ = 100 °C 5.8 6.7

TNY280 ID = 75 mA

TJ = 25 °C 2.6 3.0

TJ = 100 °C 3.9 4.5

OFF-State Drain Leakage Current

IDSS1

VBP/M = 6.2 V VEN/UV = 0 V VDS = 560 V TJ = 125 °C See Note I

TNY274-276 50

µA

TNY277-278 100

TNY279-280 200

IDSS2VBP/M = 6.2 V VEN/UV = 0 V

VDS = 375 V, TJ = 50 °C

See Note G, I15

Breakdown Voltage BVDSS

VBP = 6.2 V, VEN/UV = 0 V, See Note J, TJ = 25 °C 700 V

DRAIN Supply Voltage 50 V

17

TNY274-280

E2/06

NOTES:A. IS1 is an accurate estimate of device controller current consumption at no-load, since operating frequency is so

low under these conditions. Total device consumption at no-load is the sum of IS1 and IDSS2.

B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN. An alternative is to measure the BP/M pin current at 6.1 V.

C. BP/M pin is not intended for sourcing supply current to external circuitry.

D. To ensure correct current limit it is recommended that nominal 0.1 µF / 1 µF / 10 µF capacitors are used. In addition, the BP/M capacitor value tolerance should be equal or better than indicated below across the ambient temperature range of the target application. The minimum and maximum capacitor values are guaranteed by characterization.

E. For current limit at other di/dt values, refer to Figure 23.

F. TNY274 does not set an increased current limit value, but with a 10 µF BP/M pin capacitor the current limit is the same as with a 1 µF BP/M pin capacitor (reduced current limit value).

G. This parameter is derived from characterization.

H. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the ILIMIT specification.

I. IDSS1 is the worst case OFF state leakage specification at 80% of BVDSS and maximum operating junction temperature. IDSS2 is a typical specification under worst case application conditions (rectified 265 VAC) for no-load consumption calculations.

J. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to but not exceeding minimum BVDSS.

K. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency).

Parameter SymbolConditions

SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16

(Unless Otherwise Specified)

Min Typ Max Units

OUTPUT (cont.)

Auto-Restart ON-Time at fOSC

tARTJ = 25 °C

See Note K 64 ms

Auto-Restart Duty Cycle DCAR TJ = 25 °C 3 %

Nominal BP/M Pin Cap Value

Tolerance Relative to Nominal Capacitor Value

Min MAX0.1 µF -60% +100%1 µF -50% +100%

10 µF -50% NA

18 E2/06

TNY274-280

Figure 17. Duty Cycle Measurement. Figure 18. Output Enable Timing.

Figure 16. General Test Circuit.

PI-4079-080905

0.1 µF

10 V50 V

470 Ω5 W S2

470 Ω

NOTE: This test circuit is not applicable for current limit or output characteristic measurements.

S D

EN/UVS

S BP/M

S

150 V

S12 MΩ

PI-2364-012699

EN/UV

tP

tEN/UV

DCMAX

tP =

1

fOSC

VDRAIN

(internal signal)

0.8

PI-

4279

-013

006

Figure 19. Current Limit Envelope.

19

TNY274-280

E2/06

Typical Performance Characteristics

Figure 20. Breakdown vs. Temperature.

1.1

1.0

0.9-50 -25 0 25 50 75 100 125 150

Junction Temperature (°C)

Bre

akd

ow

n V

olt

age

(No

rmal

ized

to

25

°C) PI-

2213

-012

301

DRAIN Voltage (V)

Dra

in C

urr

ent

(mA

)

300

250

200

100

50

150

00 2 4 6 8 10

TCASE=25 °CTCASE=100 °C

PI-

4082

-082

305

TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11

Scaling Factors:

Figure 21. Frequency vs. Temperature.

Figure 22. Standard Current Limit vs. Temperature.

Figure 23. Current Limit vs. di/dt.

Figure 24. Output Characteristic.

Figure 25. COSS vs. Drain Voltage.

1.4

1.2

1.0

0.8

0.6

0.4

0.2

01 2 3 4

Normalized di/dt

PI-

4081

-082

305

No

rmal

ized

Cu

rren

t L

imit

TNY274 50 mA/µs TNY275 55 mA/µs TNY276 70 mA/µs TNY277 90 mA/µs TNY278 110 mA/µs TNY279 130 mA/µs TNY280 150 mA/µs

Normalizeddi/dt = 1

Note: For the normalized current limit value, use thetypical current limitspecified for theappropriate BP/Mcapacitor.

Drain Voltage (V)

Dra

in C

apac

itan

ce (

pF

)

PI-

4083

-082

305

0 100 200 300 400 500 600

1

10

100

1000

TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11

Scaling Factors:

1

0.8

0.6

0.4

0.2

0-50 0 50 100 150

Temperature (°C)

PI-

4102

-010

9061.2

Sta

nd

ard

Cu

rren

t L

imit

(No

rmal

ized

to

25

°C)

1.2

1.0

0.8

0.6

0.4

0.2

0-50 -25 0 25 50 75 100 125

Junction Temperature (°C)

PI-

4280

-012

306

Ou

tpu

t F

req

uen

cy(N

orm

aliz

ed t

o 2

5 °C

)

20 E2/06

TNY274-280

Typical Performance Characteristics (cont.) 50

30

40

10

20

00 200 400 600

DRAIN Voltage (V)

Po

wer

(m

W)

PI-

4084

-082

305

TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11

Scaling Factors:1.2

1.0

0.8

0.6

0.4

0.2

0-50 -25 0 25 50 75 100 125

Junction Temperature (°C)

PI-

4281

-012

306

Un

der

-Vo

ltag

e T

hre

sho

ld(N

orm

aliz

ed t

o 2

5 °C

)

Figure 27. Under-Voltage Threshold vs. Temperature.

Figure 26. Drain Capacitance Power.

21

TNY274-280

E2/06

Notes:1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing.2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 3 is omitted.5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T.

.008 (.20)

.015 (.38)

.300 (7.62) BSC(NOTE 7)

.300 (7.62)

.390 (9.91)

.367 (9.32)

.387 (9.83)

.240 (6.10)

.260 (6.60)

.125 (3.18)

.145 (3.68)

.057 (1.45)

.068 (1.73)

.120 (3.05)

.140 (3.56)

.015 (.38)MINIMUM

.048 (1.22)

.053 (1.35).100 (2.54) BSC

.014 (.36)

.022 (.56)

-E-

Pin 1

SEATINGPLANE

-D-

-T-

P08C

DIP-8C

PI-3933-100504

D S .004 (.10)⊕

T E D S .010 (.25) M⊕

(NOTE 6)

.137 (3.48)MINIMUM

PART ORDERING INFORMATIONTinySwitch Product FamilySeries NumberPackage Identifier

G Plastic Surface Mount SMD-8CP Plastic DIP-8C

Lead FinishN Pure Matte Tin (Pb-Free)

Tape & Reel and Other OptionsBlank Standard Configurations

TL Tape & Reel, 1000 pcs min./mult., G Package onlyTNY 278 G N - TL

22 E2/06

TNY274-280

SMD-8C

PI-4015-013106

.004 (.10)

.012 (.30).036 (0.91).044 (1.12)

.004 (.10)

0 - ° 8°

.367 (9.32)

.387 (9.83)

.048 (1.22).009 (.23)

.053 (1.35).032 (.81).037 (.94)

.125 (3.18)

.145 (3.68)

-D-

Notes:1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.3. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. Pin 3 is omitted.4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).5. Lead width measured at package body. 6. D and E are referenced datums on the package body.

.057 (1.45)

.068 (1.73)(NOTE 5)

E S

.100 (2.54) (BSC)

.372 (9.45).240 (6.10)

.388 (9.86).260 (6.60)

.010 (.25)

-E-

Pin 1

D S .004 (.10)⊕

⊕

G08C

.420

.046 .060 .060 .046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions.137 (3.48) MINIMUM

23

TNY274-280

E2/06

24 E2/06

TNY274-280

Revision Notes DateD Release final data sheet. 1/06

E Corrected figure numbers and references. 2/06

For the latest updates, visit our website: www.powerint.comPower Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.

PATENT INFORMATION

The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.

LIFE SUPPORT POLICY

POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:

1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, EcoSmart, Clampless, E-Shield, Filterfuse, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2006, Power Integrations, Inc.

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製品名：

Product name：

Parts name：

Parts number：

APPROVED BY (CHOP MARK AND SIGNATURE)

Please approve after understanding clause 4.-(11) on sheet 14.It is considered that it was approved when there is an order before returning this specifications.

内容説明Contents explanation

仕様内容は改善の為変更になる可能性が有ります。

仕様を満足する範囲内において、改善の為部品の一部を変更する場合が有ります。

Yasuda Bldg.No.4, 2-26-2, Tsuruyacho, Kanagawa-ku, Yokohama 221-0835, JAPAN

DSF-P0027 Ver. 0.1

'07.02.14

Arima Devices Japan Inc.Design & Development Division

Specifications 仕 様 書

仕様書番号Specifications number

作成日Creation day

RoHS

There is a possibility for change of parts within a range of specification for the improvement.

Gold-plated connector is used.

OPA-681PH-NH

OPA-681PH-NH-2

There is a possibility for change of specification for the improvement.

SUPPLIERGeneralManager

R&D QA

KachiHaneda Terajima

Arima Devices Japan Inc.

DWN. CHKD. APPD.Haneda Kachi Terajima'07.02.14 '07.02.14 '07.02.14

1.0 制定 Haneda Kachi Terajima

１－１．　適用範囲 Scope and field of Application

１－２． 評価条件 Test Conditions

２－１． 性能 Characteristics

２－２． 信頼性 Reliability

２－３． 信頼性試験条件 Reliability test conditions

２－４． 機械的仕様 Mechanical specifications

２－５． 主要部品安全規格 Safety Standerd of Main Parts

３－１． 外形図 Dimensions

３－２． 結線図 Schematic diagram

３－３． ＡＰＣ回路図 APC circuit diagram

３－４． 光路図 Optical path diagram

４． 取り扱い上の注意 Precautions for handling

製品名： Product name: Sheet

仕様書 Specifications

REVD CHKDVer. Description of Revision Date

改 訂 履 歴 Record of Revision

APPD

仕様書番号：　Specifications number:

目 次 CONTENTS

0OPA-681PH-NH DSF-P0027

Arima Devices Japan Inc.

1-1. 適用範囲　Scope and field of Application本仕様書はDVD用光 ﾋﾟｯｸｱｯﾌﾟに適用する。This specification apply to the optical pickup for DVD.

1-2. 評価条件　Test Conditions(1) 標準評価条件　Standard test environment

温度 Temperature 23±3湿度 Humidity 60±5%RH

ただし、判定に疑義が生じない場合には下記条件で測定してもかまわない。In case that doubt does not happen to determination measurement does not matter eventhe following condition.

温度 Temperature 25±10湿度 Humidity 65±25%RH

(2) 評価姿勢　Test posture対物ﾚﾝｽﾞ光軸は重力方向とする。The object lens axis makes gravity direction.

(3) 試験用装置、回路　Mechanical installation, circuit判定に疑義を生じない水準であること。It shall not ensure suspicion from the evaluation of the test results.

(4) 評価用ディスク　Test discCD: A-BEX TCD-782を使用する。　For test, use A-BEX TCD-782.DVD: A-BEX TDV-520Cを使用する。　For test, use A-BEX TDV-520C

(5) 標準試験条件　Standard test conditions特に指定しない限り、以下の条件で行う。Except specified, test under the following conditions.[a] 機械的条件　Mechanical condition

傾角　Skew ラジアル方向０度、タンジェンシャル方向０度。 Radial skew 0 deg, Tangential skew 0 deg.取付高さ　Height ガイドシャフト中心とディスクの下面までの距離が9.5mm The distance to a guide shaft center and the undersurface of a disc is 9.5mm.

[b] 回路条件　Electric offsetVcc電圧　Vcc Voltage

5.0VVc電圧　Vc Voltage

2.5Vフォーカスオフセット電圧　Focusing offset

ベストフォーカスに調整する。Adjusted to the best focusing point.

ラジアルオフセット電圧　Radial offsetD.C. 0V

APC回路　APC circuit3-3項 APC回路図によるSee section 3-3. Fig..3 APC circuit diagram

(6) 評価回転速度　Evaluation Disc speed標準速（１倍速）で測定する。　Nomal speed

製品名： Product name: Sheet

1OPA-681PH-NH DSF-P0027仕様書番号：　Specifications number:

Arima Devices Japan Inc.

2-1. 性能　Characteristics

2-1-(1) 基本仕様　Basic specifications 種類　Type 光ピックアップ　Optical pickup

用途　Application DVD , CD-DA(Compact Disc Digital Audio) , VCD(Video CD)

方式　Method DVD 光源 半導体レーザー　Laser diodeDVD Light source 波長　Wavelength：　650Min.～655Typ.～660Max. nm

型番　Type：　ADL-65075GRﾒｰｶｰ：　華上光電公司Manufacturer：　Arima Optoelectronics Corporation

CD 光源 半導体レーザー　Laser diodeCD Light source 波長　Wavelength：　770Min.～790Typ.～805Max. nm

型番　Type：　ADL-78031FRﾒｰｶｰ：　華上光電公司Manufacturer：　Arima Optoelectronics Corporation

光検出器 ６分割PDIC 6 Divided PDICPhoto detector 型番　Type：　PH9119A4NF1

ﾒｰｶｰ：　NEC化合物デバイス株式会社Manufacturer：　NEC corporation

アクチュエータ　Actuator 4本ワイヤータイプ　4-wire type

ﾌｫｰｶｽｴﾗｰ　Focus error 非点収差方式　Astigmatic method

ﾄﾗｯｷﾝｸﾞｴﾗｰ　Tracking error DVD：　位相差検出法　DPD method

CD：　3ビーム方式　3-beam method

光学系　Optical 対物レンズ　Objective lens DVD：　f=3.05mm NA=0.60 WD=1.67mm

CD：　f=3.07mm NA=0.47 WD=1.30mm

対物レンズ出射光量 DVD ：　0.6 mW max 連続 ContinuousEmitting light output at objective lens CD ：　0.5 mW max 連続 Continuous

動作温度 10～80 %RH -10～60 Operating environment 保存温度 -30～70 Non-operating 但し急激な温度変化を与えて結露を生じさせないこと。

environment Avoid dew caused by rapid thermal change.

寸法　Dimensions 3-1項による 外形　Appearance See section 3-1 Fig.1 重量　Weight 15g(Nom.)

使用姿勢 Use attitude ﾄﾗｯｷﾝｸﾞ方向が重力方向となす角度は45°以上を推奨。The angle that tracking direction does with gravity directionrecommends 45 or more degree.

製品名： Product name: Sheet仕様書番号：　Specifications number:

2DSF-P0027OPA-681PH-NH

Arima Devices Japan Inc.

2-1-(2) 電気性能 Electrical performance条　件 Condition

ﾚｰｻﾞｰﾀﾞｲｵｰﾄﾞ (DVD)Laser diode 最大定格 Tc=25 Maximum ratings 光出力 Po CW 10 mW ADL-65075GR Light output power

逆電圧 Vrl,Vrd - 2 V Laser diode Reverse voltage 30 V Monitor pin photo diode

電気特性 Tc=25 Electrical characteristics 動作電流 Iop Po=7mW 35 mA max 25 mA typ ADL-65075GR Operating current

動作電圧 Vop Po=7mW 2.5 V max 2.2 V typ ADL-65075GR Operating voltage

ﾚｰｻﾞｰﾀﾞｲｵｰﾄﾞ (CD)Laser diode 最大定格 Tc=25 Maximum ratings 光出力 Po CW 5 mW Light output power

逆電圧 Vrl,Vrd - 2 V Laser diode Reverse voltage 30 V Monitor pin photo diode

電気特性 Tc=25 Electrical characteristics 動作電流 Iop Po=3mW 55 mA max 45 mA typ ADL-78031FR Operating current

動作電圧 Vop Po=3mW 2.3 V max 1.8 V typ ADL-78031FR Operating voltage

アクチュエータActuator

　ﾌｫｰｶｽｺｲﾙ駆動電流 連続 150 mA rms max 但しトラッキングは0mA　Focusing coil current Continuous 0mA for tracking

　ﾄﾗｯｷﾝｸﾞｺｲﾙ駆動電流 連続 150 mA rms max 但しフォーカスは0mA　Tracking coil current Continuous 0mA for focusing

製品名： Product name: Sheet

仕 様 Specifications

3DSF-P0027

項 目 Items

仕様書番号：　Specifications number:

OPA-681PH-NH

Arima Devices Japan Inc.

条　件 Conditionﾌｫﾄﾃﾞｨﾃｸﾀｰ (PDIC)Photo detector 最大定格 Tc=25 Maximum ratings 電源電圧 Vcc - 6 V Power supply voltage

許容損失 PD 240 mW Allowable dissipation

推奨電源電圧範囲 Vcc ：+4.5 ～+5.5 V Recommended power Vc ：+1.5 ～Vcc-2.0 V

supply voltage range

電気特性 Tc=25 Electrical characteristics Vcc=5.0V, Vc=2.5V

RL=3kΩ, CL=10pF(NEC)

最大出力電圧 VoM Pi=10μW A～D ：195 mV min 260 mV typ 325 mV max Maximum output voltage λ=780nm E～F ：350 mV min 470 mV typ 590 mV max

RF ：330 mV min 440 mV typ 550 mV max

Pi=10μW A～D ：205 mV min 275 mV typ 345 mV maxλ=650nm E～F ：370 mV min 495 mV typ 620 mV max

RF ：345 mV min 460 mV typ 575 mV max

遮断周波数 fc from 100kHz, -3dB A～D ：65 MHz min 100 MHz typ - max Cut off frequency λ=650nm, 780nm E～F ：0.5 MHz min 2 MHz typ - max

RF ：60 MHz min 90 MHz typ - max

製品名： Product name: Sheet

仕 様 Specifications

OPA-681PH-NH DSF-P0027 4仕様書番号：　Specifications number:

項 目 Items

Arima Devices Japan Inc.

2-1-(3) アクチュエータ規格 Actuator characteristics

フォーカス　Focusing 対物レンズ可動量 フォーカス基準位置より ±0.7 mm以上 or more Movable distance From focus center position

コイル直流抵抗 D.C. 5.5～7.5 ohm B±30% Coil resistance at 25

位相遅れ量 at 1～5 KHz max 25 deg C±10deg Phase delay 共振周波数 振幅ピーク値の周波数 50～60 Hz +5Hz Resonance freq. (fo) Frequency of amplitude peak -8Hz 共振ピーク量 共振周波数での振幅値 max 14 dB C±5dB Resonance peak value (Q) Amplitude value in

resonance frequencyQ = Gain(fo) - Gain(5Hz)

高次共振周波数 振幅ピーク値の周波数 18 KHz以上 or more A 18 KHz以上 Higher-order Frequency of amplitude peak or more

resonance frequency ピーク交点周波数 共振ピークと中域ゲインの交点 10 KHz以上 or more A 10 KHz以上 Peak intersection The intersection of a higher-order or more

frequency resonance peak and a middle range gain

5Hz感度 0.81～1.09 mm/V B±30% Sensitivity(5Hz) 200Hz感度 44～60 μm/V B±30% Sensitivity(200Hz)

*Measurements in terminal of ACT PCB*The above-mentioned data is without FPC and FFC

製品名： Product name: Sheet

Items Condition

信頼性規格

Specifications

5

項 目 条　件 仕 様Reliability

spec.

仕様書番号：　Specifications number:

OPA-681PH-NH DSF-P0027

C

Arima Devices Japan Inc.

トラッキング　Tracking 対物レンズ可動量 自由中立点からの可動量 ±0.4 mm以上 or more Movable distance From free position

コイル直流抵抗 D.C. 4.0～5.4 ohm B±30% Coil resistance at 25

位相遅れ量 at 1～5 KHz max 15 deg C±10deg Phase delay 共振周波数 振幅ピーク値の周波数 50～60 Hz +5Hz Resonance freq. (fo) Frequency of amplitude peak -8Hz 共振ピーク量 共振周波数での振幅値 max 14 dB C±5dB Resonance peak value (Q) Amplitude value in

resonance frequencyQ = Gain(fo) - Gain(5Hz)

高次共振周波数 振幅ピーク値の周波数 18 KHz以上 or more A 18 KHz以上 Higher-order Frequency of amplitude peak or more

resonance frequency ピーク交点周波数 共振ピークと中域ゲインの交点 10 KHz以上 or more A 10 KHz以上 Peak intersection The intersection of a higher-order or more

frequency resonance peak and a middle range gain

5Hz感度 0.57～0.93 mm/V B±30% Sensitivity(5Hz) 200Hz感度 34～46 μm/V B±30% Sensitivity(200Hz)

チルト精度　Tilt accuracy タンジェンシャル方向 Focus： ±0.5 ±0.3 deg A±0.3deg Tangential direction DVDフォーカス基準位置より

From focus center position for DVD ラジアル方向 Tracking： ±0.3 ±0.3 deg A±0.3deg Radial direction 自由中立点より

From free position

*Measurements in terminal of ACT PCB*The above-mentioned data is without FPC and FFC

対物レンズの動作　Direction of objective lens movement

フォーカス方向　Focusing directionコネクタのFo+ピンにプラス電圧が印可された場合、対物レンズはディスクに近づく方向に動く。When positive voltage applied to Fo+ pin, the objective lens moves toward the disc.

トラッキング方向　Tracking directionコネクタのTR+ピンにプラス電圧が印可された場合、対物レンズはディスクの内周方向に動く。When positive voltage applied toTR+ pin, the objective lens moves toward the inner of disc.

製品名： Product name: Sheet

Condition

DSF-P0027

Items

項 目 条　件

6仕様書番号：　Specifications number:

spec.Specifications

信頼性規格仕 様

Reliability

OPA-681PH-NH

CC

Arima Devices Japan Inc.

2-1-(4) 信号再生規格 Electrical characteristics

RF信号　RF signal 信号振幅 DVD：14Tの振幅値(p-p) DVD： 1.08±0.22 Vp-p B±40% B±25% Signal level DVD：p-p level of 14T signal.

CD：11Tの振幅値(p-p) CD： 0.65±0.15 Vp-p B±25% B±25%CD：p-p level of 11T signal.Gain 1X(A+B+C+D) output

ジッター量 DVD：クロックジッター DVD： 10.5 % max. A 14% max. A 14% max. Jitter DVD：Data to the standard clock

CD：3Tジッター標準偏差 CD： 26 nsec max. A 32nsec max. A 32nsec max.CD：Standard deviation of 3T jitter

ﾌｫｰｶｽｴﾗｰ信号 Focusing error signal FE=(A+C)-(B+D) 信号振幅 Sカーブの振幅値(p-p) DVD： 1.25±0.35 Vp-p B±30% Signal level p-p level of S-curve CD： 0.79±0.26 Vp-p B±30%

信号バランス エラー信号のセンターずれ量 ±17 %　以下 C±20% Signal balance Deviation of signal Less than

信号検出範囲 Sカーブの(p-p)に対する範囲 DVD： 6.0 μm 設計値 Design value Detecting range S-curve p-p range CD： 6.0 μm 設計値 Design value

合焦ずれ ジッター最良点と動作基準 DVD： ±20 % C±20% Defocus 位置との距離 CD： ±17 % C±17%

Distance of best jitter position and standard position

極性 (A+C)-(B+D)<0 の時は合焦点よりディスクが近い状態 Polarity If (A+C)-(B+D)<0,disc closer than focalpoint.

CD： ﾄﾗｯｷﾝｸﾞｴﾗｰ信号 Tracking error signal TE=E-F 信号振幅 エラー信号の振幅値(p-p) 0.12±0.06 Vp-p B±30% Signal level Signal p-p level

信号バランス エラー信号のセンターずれ量 ±30 % C±20% Signal balance Deviation of signal

回折格子調整精度 Subtract 180 from phase ±45 deg C±15deg Grating adjustment shift between E and F signal

Position: approx. 37.5mm from center of disc

極性 E-F>0は内周方向へスポットがずれた時 Polarity If E-F>0,the spots are slipped off the track to the inside.

製品名： Product name: Sheet

Specifications

仕様書番号：　Specifications number:

spec.Items

項 目

項 目

Items

条　件

信頼性規格Reliability spec.

仕 様

OPA-681PH-NH DSF-P0027 7

Reliability

Operating

仕 様

Specifications

信頼性規格

Non-operating

Condition

Condition

条　件

Arima Devices Japan Inc.

2-2. 信頼性　Reliability

2-2-(1) 環境試験 Environment test

放置試験　Non-operating test 高温保存 Temperature: 70 各条件雰囲気中に非動作にて放置し、常温・常湿中に High temperature Time: 24H 取り出し、72時間放置後再生性能を測定する。

温度試験に関しては疑義を生じない限り、16時間 低温保存 Temperature: -30 放置後の測定を可とする。 Low temperature Time: 24H Leave the non-operating pickup under each condition

and leave under standard environment for 72 hours 高湿保存 Temperature: 40 and measure. High humidity Humidity: 90% If there are no suspicion, it may be measured after

Time: 48H 16 hours regarding to the temperature test.

温度サイクル Temperature: -20,60 .4h 1h 1h 1h .6h Temperature cycle Cycle: 5 cycles +60

+25-20

4 hours

温度特性試験　Operating test 高温動作 Temperature: 60 条件雰囲気中にて4時間以上放置後、同条件中で High temperature 10分以上動作させ、下記項目を測定する。

試験項目：　ジッター量、RF信号振幅 低温動作 Temperature: -10 Before applying the following test, leave the pickup Low temperature under the condition mentioned in the left for more

than 4 hours and operate the unit for 10 minutes under the same condition. Test items: jitter, RF signal level

2-2-(2) 輸送試験 Transit test

振動試験 加速度　Acceleration: 2.4G constantVibration test 周波数　Frequency: 10～50Hz

Sweep time: 5 minutes(往復 up & down)方向　direction: 3 directions(X, Y, Z)時間　Time: 0.5 hour X 3 directions, total 1.5 hours振動試験機を使用する。　Use vibration test machine.

衝撃試験 加速度　Acceleration: 80G, 6 msecondShock test 方向　Direction: 3 directions 6 faces(±X, ±Y, ±Z)

3 times X 6 faces, total 18 times.衝撃試験機を使用する。　Use shock test machine.

製品名： Product name: Sheet

条　件

Condition

項 目

Items

項 目 方　　法

8仕様書番号：　Specifications number:

DSF-P0027

Test method

OPA-681PH-NH

方　　法条　件

Condition

Test methodItems

Arima Devices Japan Inc.

2-3. 信頼性試験条件　Reliability test conditions

(1)試験条件、姿勢　Test condition, posture標準試験条件と同一条件で測定することを原則とする。The reliability test shall be conducted at the same conditions as the standard test.

(2)試験用測定器、ディスク　Measuring instrument, disc標準試験と同一の測定器または、同等品を用いる。但し、測定器、ディスクはやむを得ない場合を除き特殊環境中に入れてはならない。The same measuring instrument and disc of equvalent as used in the standard test shall be used.But the instrument and disc shall not be entered into a specific environment exept in case of inevitable.

(3)測定　Measurements電気系の設定、及び機械的設定は、標準試験条件の初期設定のままで行う。The electric and mechanical measurements of this test shall take place as they were initially measured at the standard test conditions.

(4)適用規格　Specifications各試験による性能は、適用規格欄の分類に基づき規格一覧表により判定する。See the column of reliability specifications and classification (A, B, C).

A: 絶対値　Absolute valueB: 対初期比　Ratio to initial valueC: 対初期差　Difference from initial value

(5)結露　Dew condensation試験中は結露することのないようにする。The dew condensation under test implementation is strict prohibition.

(6)対物レンズ　Objective lens対物レンズが汚れた場合は清掃後に測定する。Clean and measure it when object lens is dirty.

2-4. 機械的仕様　Mechanical specifications

(1)外形寸法、送り部品取付部：　3-1 外形図 Dimension, feed parts attachment part: 3-1 Fig.1 Dimensions

(2)コネクター結線：　3-2 結線図 Connector wiring: 3-2 Fig.2 Schematic diagram

(3)送りガイド用軸受け　Feed guide bearing.① 基準軸受け　Master bearing: 2-φ3(+0.015, -0.000) mm② 従動軸受け　Sub bearing: 3(+0.020, +0.005) mm③ 治具（シャフト径　φ2.998 X 2本使用）に取付、自重で落下すること。

Set the pickup to jig and the pickup shall fall free.

製品名： Product name: Sheet

OPA-681PH-NH 9DSF-P0027仕様書番号：　Specifications number:

Arima Devices Japan Inc.

2-5. 主要部品安全規格 Safety Standerd of Main Parts

2-5-1. Connector

Material Manufacture Material UL File Type No

Material Manufacture Material UL File Type No

2-5-2. Printed circuit boards

製品名： Product name: Sheet

PCB-ACTELEMENT DENSHI CO LTD E36 94V-0

E160353

GT10T

FPC1020 94V-0

UL File No.

1, CM 94V-0

94V-0

94V-01140-A1

E226898

Parts Material Manufacture Type UL Flame Class

FPC0.5H-SMT-24P G : Manufactured by SHANGHAI YUESHEN ELECTRONIC CO LTD

E109088PPS

Name ClassParts

Socket Housing

Name

Slider Housing POLYPLASTICS CO., LTD.

Parts Material GenericClass

TS250F4D 94V-0DSM JAPAN ENGINEERINGPLASTIC K.K

PA4/6

94V-0PA4/6DSM JAPAN ENGINEERINGPLASTIC K.K

10仕様書番号：　Specifications number:

Material Generic UL Flame

E172082TS250F6D

LD03T2-24ND-01 : Manufactured by SUMIKO TEC CO LTD

1140-A6HF2000

94V-0 E109088

E172082

UL Flame

Socket Housing

OPA-681PH-NH DSF-P0027

E69115

E220250

Slider Housing POLYPLASTICS CO., LTD. PPS

FPC-OPTShenzhen Flexcircuits Co., Ltd.

Towa Devices Corp.

Ya Hsin Industrial Co., Ltd.

Arima Devices Japan Inc.

3-1. Fig.1外形図 Dimensions

製品名： Product name: Sheet仕様書番号：　Specifications number:

11DSF-P0027OPA-681PH-NH

Arima Devices Japan Inc.

3-2. Fig..2 結線図 Schematic diagram

コネクタピン配列について *先行スポット(Lead spot): FConnector pin layout *FPC Connection: pitch=0.5mm　　図示方向：対物レンズ側より見る *Vcc=5V , Vc=2.5V　　View from the objective lens side *FPC/FFC Connection: pitch=0.5mm

コネクタ仕様　Connector Spec.

メッキ厚 Plating thickness [μm]

Min Typ Max Min Typ MaxLD03T2-24ND-01 Au 0.056 0.0864 0.105 1.795 2.0764 2.320 *1

YUESHEN FPC0.5H-SMT-24P G Au 0.076 0.1016 0.127 1.270 2.1590 3.048*1 The plating thickness is a measurement value by the connector manufacturer. (n=100)

製品名： Product name: Sheet

SUMIKO TEC

ﾒｰｶｰ Manufacturer

型番　 　　　　　 処理　Type Plating 下地 priming Ni

OPA-681PH-NH仕様書番号：　Specifications number:

Au

12DSF-P0027

contact side connector

Arima Devices Japan Inc.

3-3. Fig..3 APC回路図 APC circuit diagram

3-4. Fig..4 光路図 Optical path diagram

製品名： Product name: Sheet仕様書番号：　Specifications number:

13

SW2 OFF → SW1 OFF

OPA-681PH-NH DSF-P0027

DVD-LD power supply OFF procedure

DVD-LD power supply ON procedureSW2 OFF → SW1 DVD ON → SW2 DVD-LD ON

DVD Vref=0.18V

CD Vref=0.18V

Arima Devices Japan Inc.

4. 取り扱い上の注意　Precautions for handling

（１） 対物レンズからはレーザ光が放射されます。動作中のLDを直視したり、あるいは他のレンズやミラーを介して光束を監視すると危険ですから、絶対に行わないで下さい。　もし観察するときは、赤外線ビューアーかITVカメラ等を使用して下さい。Laser light is emitted from an object lens. Never look directly into the LD or observe the laser beam through another lens or mirror. If you need to view the beam, use an infrared viewer or an ITV camera.

（２） 半導体レーザは静電気によって破壊されやすいので、ピックアップの取り扱いに際しては静電気の発生を防止するようにご注意下さい。　作業を行う床と机上には静電防止マットを敷き、高抵抗（１ＭΩ程度）を介してアースと接続して下さい。作業を行う人は手首にリストストラップを着用し、高抵抗（１ＭΩ程度）を介してアースと接続して下さい。Take precaution against static electricity for handling the pickup, because laser diode may be destroyed by static electricity. Spread conductive rubber sheet to floor and desk and connect to ground through high impedance resistor (about 1MΩ). Use wrist band and connect to ground through high impedance resistor (about 1MΩ).

（３） ＬＤの端子は、出荷時に輸送による静電気破壊防止のため、半田ショートされています。　　ショート部の開放は、コネクタ差し込み後半田鏝で行って下さい。　使用する半田鏝は、金属部分が接地されたもの或いは通電５分後の絶縁抵抗が１０ＭΩ以上（Ｄ．Ｃ． ５００Ｖ）のもので、半田鏝先が３３０以下（３０Ｗ）のものを使用し、速やかに行って下さい。The terminal of laser diode is shorted with solder for protecting laser diode. Open the terminal by solder iron quickly after connecting circuit. Use solder iron that metal part of iron is earth connected or insulations resistance is over 10MΩ(500V D.C.) at working and temperature of heater chip is less than 320 degree(30W).

（４） 半導体レーザは過電流に非常に弱いので、電源のon-offに際してはスパイク電流を流さないような電源回路を使用して下さい。　定格を越す光出力を発生させる電流を流さないようご注意下さい。When tuning on or off the APC circuit, use power source which generate no spike current, because laser diode may be broken by over current. Take precautions not to operate laser diode over rated output level by over current.

（５） 対物レンズに付着したゴミや埃はレンズ用ブロワーを使用して丁寧に吹き飛ばして下さい。　対物レンズに指紋等の汚れを付けないように特にその取り扱いにご注意下さい。　万一、汚れが付着した場合にはレンズペーパーにクリーニング液（日本綿棒Tel03-3573-1884 CDレンズクリーナ液B4）を少量付けて軽く拭き取って下さい。Use lens-blower carefully to blow dust on the objective lens. Please pay attention so as not to attach the dirt of fingerprint etc. to the object lens, especially to the handling. If the objective lens got dirty, wipe slightly with lens cleaning paper moistened with cleaning liquid (B4) made by JCB INDUSTRY Ltd.

（６） ピックアップの保管や輸送については、対物レンズが下向き、または基準シャフトが下向きになるようにして下さい。高温高湿下・低温下・埃・砂塵などの多い場所での保存は避けてください。The storage and transport of the pickup about, the object lens please do as downward, or master bearing becomes downward. Do not store under high temperature and high humidity, low temperature and dusty environment.

（７） LDのチップは、GaAs+GaAlAsで毒物として良く知られているAsを含んでいます。　　毒性は、他の化合物、例えばAs2O3、AsCl3等に比較し、はるかに弱い毒性で素子1ヶ当たりは少量ですが、チップを取り出し酸やアルカリへ入れたり、200゜C以上に加熱したり、口に入れたりすることは絶対行わないで下さい。　ライン不良、サービスパーツの不良品は、廃棄物入れにまとめて入れ、御社指定の方法で廃棄処理をして下さい。The LD chip is manufactured from GaAs and GaAlAs, which contains toxic As(Arsenic). The toxicity of As in this form is far lower than other As compounds such as As2O3 and AsCl3,and the As content of one chip is very small. However, avoid putting the chip in an acid or alkali solution, heating it over 200゜C, or putting it your mouth. Defective LDs from the production line and parts removed in servicing should be disposed of with due care.

（８） 本製品は精密調整されています。　分解、調整は行わないでください。　不用意な取り扱いによる衝撃や落下など無いようにしてください。　対物レンズ、アクチュエータ、VR、レーザモジュール部は手を触れたり力を加えないでください。This pickup is already adjusted precisely. Do not decompose or readjust. Pay attention not to drop or not to shock due to rough handling. Do not touch and do not give force to following parts of the unit: a. The objective lens b. The actuator c. The variable resistor d.The laser module

（９） アクチュエータ：強力な磁気回路を有していますので、鉄片などの磁性体が近づきますと特性が変化しますのでご注意ください。　また、カバーの隙間から異物の入ることの無いようにして下さい。Due to strong magnetic circuit, pay attention not to close magnetic materials like iron. Take care of not entering small pieces of substance into the opening of the cover.

（１０） レーザーへの戻り光によるノイズ低減のため、DVD-LDに高周波を重畳しています。　輻射レベル低減のための対策はしていますが、お客様の製品からの放射ノイズを規定内に抑える事を保証するものではありません。予測できない症状・事態を確認するためにも、お客様の製品で必要とされる評価・試験を必ず行ってください。The high frequency is superimposed to DVD-LD for the noise decrease to the laser by the return light.It is not the one to guarantee to suppress the radiation noise from customer's product in regulations though measures for the radiation level decrease are done. Do the evaluation and the examination needed in customer's product to check the symptom and the situation not predictable.

（１１） FPC・FFC用コネクタが金めっき仕様の場合はFPC・FFC接触部の表面処理は金めっきとしてください。異種金属の組み合わせは接点が腐食し接触不良の原因になるため避けてください。Make the surface treatment in the FPC・FFC contact part a gold plating when the connector for FPC・FFC is a gold-plated specification.Avoid the combination of dissimilar. Otherwise, the point of contact corrodes and it causes the loose connection.

製品名： Product name: Sheet

14DSF-P0027OPA-681PH-NH仕様書番号：　Specifications number:

Arima Devices Japan Inc.

Na

me

Mod

el

Num

ber

View

08

control button

1

Item

Scale

Sheet

01

DV

3110-JG01-01

DV

3 110

Explod

ed V

iew

Qty

Unit

A

Ma

terial

Version

02 03 04 05 06 07

USB cover

Ap

proval

Part N

umer

Authorize

Prepare

Date

Descrip

tion

Date

Date

front panel

front panel m

irror

1

Qty 1 1 1 1 1 1

1009 11 12 13 14

pow

er button

cd door mirror

cd door

SCA

RT board

loader

top cover

1 1 1 1 1 1

1

2

3

4

5

bottom

decod

ing board

ba

ck panel

control PCBA

Shenzhen MTC

Co., Ltd

R

QR-RD

-014B

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Procedimiento para cambio de región

All of the DVDs we default all region in firmware ,If need change pls following below way

1, Current region display:Open the loader , press 9735 on remote and press 9

2, Change region Open the loader, press 9735 and" Region code " Such as 1 ,or 2,or 3.... It can change region which you want .

file:///I|/Manuales%20de%20Service/Electronica/A%20LLENAR/OEM/DVZ308(Nisato)/Free%20Zone%20setting.txt22/07/2009 02:40:25 p.m.